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E20-542 VMAX3 Solutions and Design Specialist test for Technology Architects

Exam Title : Dell EMC Certified Specialist - Technology Architect - VMAX3 Solutions Specialist (DECS-TA)
Exam ID : E20-542
Exam Duration : 90 mins
Questions in test : 60
Passing Score : 63%
Official Training : VMAX3 Fundamentals (MR-1WP-VMAXFD),
VMAX3 Local Replication Fundamentals (MR-1WPVMAXLRFD)
VMAX3 Remote Replication Fundamentals (MR-1WPVMAXRRFD)
Exam Center : Pearson VUE
Real Questions : Dell EMC VMAX3 Solutions and Design Specialist Real Questions
VCE VCE test : Dell EMC E20-542 Certification VCE Practice Test

VMAX3 Configuration Management 28%
- VMAX3 Array Configuration and storage provisioning concepts
- Virtual provisioning concepts and automated tiering
- Storage allocation using autoprovisioning groups
- Device creation and port management
- Monitor storage resource pools and SLO compliance
- Workload Planning with Unisphere for VMAX
- eNAS Management

VMAX3 Business Continuity Management 35%
- TimeFinder SnapVX operations with SYMCLI and Unisphere for VMAX
- SRDF operations in synchronous (SRDF/S) and asynchronous (SRDF/A) modes using SYMCLI and Unisphere for VMAX

Unisphere for VMAX Implementation and Management 7%
- Unisphere for VMAX functionality and architecture
- Navigating the Unisphere for VMAX GUI
- VMAX administration using Unisphere for VMAX
- Service level-based provisioning

VMAX3 Solutions Design 30%
- Best practices for designing a VMAX3 solution
- Designing a VMAX3 solution with VMAX Sizer
- Remote replication – Network connectivity considerations
- Designing SRDF/S solutions
- Designing SRDF/A solutions

VMAX3 Solutions and Design Specialist test for Technology Architects
EMC Specialist history
Killexams : EMC Specialist history - BingNews https://killexams.com/pass4sure/exam-detail/E20-542 Search results Killexams : EMC Specialist history - BingNews https://killexams.com/pass4sure/exam-detail/E20-542 https://killexams.com/exam_list/EMC Killexams : The History and Legacy of EMC World

Technology trade shows have a deep and rich history in the IT industry. Companies and IT workers arrive at these conventions to learn, network, collaborate and take stock of the industry as a whole.

EMC, a leading data and information management technology company, has played host to its own trade show for the past 11 years. This year’s show in Las Vegas is poised to be another impressive gathering of top-tier IT minds and talents.

EMC World, which was once known as the EMC Enterprise Wizards Conference, has rotated between the cities of Boston, Las Vegas, New Orleans and Orlando, Fla. Each year, the company’s customer and partner conference has seen steady growth.

In 2007, Whitney Tidmarsh, who was vice president of marketing for the EMC Content Management and Archiving business unit at the time, remarked that at 7,000 attendees, the conference had quadrupled in size from what it was in 2004. In 2008, Joe Tucci, EMC’s chief executive officer, noted that the conference had succeeded in drawing over 9,000 attendees. Last year’s show brought in over 10,000 attendees, which the company announced was the largest attendance in the conference’s history.

Before we gear up for this year’s show, let’s review some of the highlights from Tucci’s past EMC World keynote speeches.

In Joe Tucci’s Words

“If you think about it, one of the most untapped management needs in any organization is all these thousands and thousands and thousands of file systems they have sitting across the whole organization. So with file virtualization technology … they'll be able to centrally manage that, share it and really help control the costs and the growth of those file systems.” — 2007 EMC World Keynote

“We're gonna have to deal with this proliferation of information so that we make sure it doesn't overwhelm us, that we fall victim to it, but we take that information and use it to get us benefit and value for ourselves and for our companies.” — 2008 EMC World Keynote

“Whether you operate on your internal cloud or operate on a partner service provider cloud, you'd have the same level of trust, the same level of dynamic [computing], the same level of efficiency. You'd be just as secure, just as reliable, and you can still sleep at night and costs will go down. That's the vision that we have and that's how we're defining cloud computing.” — 2009 EMC World Keynote

“IT infrastructures have gotten too complex, too inefficient, too inflexible and too costly to take us to where we need to be. 72 percent of IT investment is to maintain existing applications, existing infrastructure. Only 28 percent is spent on real new innovation and new technologies, that can help a company power its revenue.” — 2010 EMC World Keynote

“We are coming from a PC-only world, to a world where you have iPads, smartphones and a tremendous amount of choice. Companies are now looking to provision these in a singular way, and how they are being managed is going through a significant change.” — 2011 EMC World Keynote

Stay tuned to biztechmagazine.com for more EMC World coverage in the coming week.

<a href="http://www.flickr.com/photos/emccorp/2510504302/sizes/o/in/set-72157605159999132/" target="_blank">Flickr/emccorp</a>

Wed, 07 Sep 2022 12:00:00 -0500 Ricky Ribeiro en text/html https://biztechmagazine.com/article/2012/05/history-and-legacy-emc-world
Killexams : Ben Russo Steps Down as CEO of EMC Brands, Dianne Quirante Promoted as Replacement

After a 15-year tenure, Russo will stay on to serve as client adviser and COO while he divides his time between Miami and EMC headquarters in West Hollywood.

Veteran publicist Ben Russo is stepping down from his post as CEO of EMC Brands, a company he co-founded in 2007. The firm’s long-serving Dianne Quirante has been promoted from senior vp to CEO, taking over for Russo, effective immediately.

Russo is not exiting completely, however. He will stay on to serve as client advisor and COO while he divides his time between Miami and EMC headquarters in West Hollywood.

“Over the past 16 years, there have been a few iterations of EMC as we adapted and maneuvered with the changing landscape of media and consumer behavior,” said Russo, nodding to the firm’s earlier identity as EMC Bowery, which he co-founded alongside Jack Ketsoyan, who departed earlier this year to form Full Scope Public Relations. “Dianne will continue the brilliant art of strategic brand building for EMC’s client roster. She is, by far, the most qualified and passionate person to continue my dream.”

Quirante has been with EMC for 12 years to Russo’s 15. During their tenure, the company has specialized in the hospitality and lifestyle space with a client roster that has included The h.wood Group (The Nice Guy, Delilah, Bootsy Bellows, Harriet’s, Sant’olina, Slab), Innovative Dining Group (Boa Steakhouse, Katana, Sushi Roku), Cîroc Vodka, DeLeón Tequila, Guillotine Vodka, Tatel Beverly Hills, Ella Restaurant, Sixty Hotel Beverly Hills, Vandelay Hospitality Group, Sunny Vodka, The Lyfestyle Co., Sweat Cycle, Sweat_Ext and celebrity-fueled parties at events like Coachella, the Super Bowl, New York Fashion Week and more.

“I am forever blessed to have such a strong, mentoring connection with Ben. It’s an honor to continue the excellence of EMC as CEO with new energy and dedication,” added Quirante. “I’ve always been a publicist at heart as an artist and visionary. I simply love the creative elements in bringing brand stories to life. With our new dynamic and talented team established we are ready to perform and conquer.”

As part of the executive shuffle, Quirante will oversee and work alongside EMC’s staff, which includes David Malushi, who is charged with overseeing influencer and media management. Quirante has struck strategic alliances with PR and marketing insiders, including Abegail Cal of AJC Public Relations and Elle Senina of Saucy Creative. Robert Barrios will act as chief counsel for EMC in the brands and entertainment events division while the CP Group’s Vedika Solecki will serve as global brand ambassador and Garrett O. Thomas is confirmed to help lead EMC’s social media and digital activities. 

Oct. 10, 11:05 a.m.: Updated to reflect correct roles for Solecki and Thomas.

Mon, 10 Oct 2022 06:50:00 -0500 en-US text/html https://www.hollywoodreporter.com/business/business-news/emc-brands-ben-russo-dianne-quirante-1235236155/?_escaped_fragment_=
Killexams : Dell Plans To Buy EMC For $67 Billion: Coverage Of The Biggest Tech Deal Ever

Dell's announcement to buy storage giant EMC $67 billion solidifies the largest deal in the history of the IT business, creating in its wake a channel behemoth set to dominate the enterprise IT market.

Dell-EMC

Dell's announcement to buy storage giant EMC for $67 billion solidifies the largest deal in the history of the IT business, creating a channel behemoth set to dominate the enterprise IT market. The landmark deal transforms the onetime PC maker, created in Dell founder and CEO Michael Dell's dorm room, into a $90 billion computing force. The deal will enable Dell, the No. 2 server maker, to leverage EMC's dominance in the storage market, setting up the Round Rock, Texas-based company to take on rivals Hewlett Packard Enterprise, Cisco and Oracle as well as upstarts such as Nutanix.

The deal, in which Dell will offer EMC shareholders $33.15 per share, includes EMC subsidiary VMware as a tracking stock that amounts to about $9 per share. Partners are calling the EMC acquisition by Dell a "dream deal," with the belief that it will energize sales for partners, up data center IQs and boost bottom lines.

CRN is covering the deal from all sides. Check here for the latest news surrounding this blockbuster, as well as analysis and exclusive takes from Dell and EMC's biggest competitors.

News & Analysis

Dell-EMC

The Competition

Sun, 25 Jul 2021 12:19:00 -0500 en text/html https://www.crn.com/news/dell-buys-emc-for-67-billion.htm
Killexams : Achieving 99% Improvement in EMC Compliance for MEMS Systems

Richard Anslow, System Applications Engineer and Ricardo Zaplana, Design Engineer, both at Analog Devices

MEMS systems are used for vibration monitoring in railway, wind turbine, motor control, and machine tool applications to enhance safety, reduce costs, and maximise the useful life of equipment. MEMS sensors, with superior low frequency performance, enable earlier detection of bearing defects in railway and wind turbine applications compared to competing technologies. Significant cost savings are coupled with higher detection rates for equipment defects, ensuring compliance with stringent safety standards. Wide bandwidth (0Hz to 23kHz), low noise performance, and wide vibration measurement range (2g to 200g) are all required for vibration monitoring. This is easily achieved using Analog Devices’ broad MEMS portfolio.

Wired communication systems are used for vibration monitoring where raw data from several sensors is gathered, or where raw data is used for real-time control. There are several challenges in implementing a wired condition-based monitoring (CbM) system. One key challenge is electromagnetic compatibility (EMC) robustness when operating over meters of cabling, which can be subjected to indirect lightning surges, electrostatic discharges, and environmental noise such as switching of inductive or capacitive loads. Poor robustness to EMC disturbances can intermittently or permanently degrade the quality of data gathered from the CbM systems, as shown in Figure 1. Over time, poor quality data can lead to incorrect decisions around asset health and maintenance.

This article outlines key challenges in designing for EMC standards compliance with today’s highly integrated CbM solutions. Design for EMC is notoriously difficult to get right the first time, with even small changes in circuits or lab test setup dramatically affecting test results. This article presents a system-level EMC simulation approach or virtual lab, which helps the engineer to get the design EMC compliant in record time.

Figure 1. Wired CbM system with vibration sensors located in EMC harsh industrial environments.

Why Is System-Level EMC Simulation Important?

Modern product development schedules include a parallel EMC compliance task. Design for EMC should be as seamless as possible, but this is often not the case, with EMC problems and lab testing delaying product release by months. The virtual lab EMC simulation approach helps the engineer solve EMC problems much faster compared to lab test alone. The virtual lab simulation approach helps to solve key problems in achieving EMC compliance because:

  • Increased integration and component density in modern PCB designs leads to complex problems, with multiple EMC failure Simulation can help to determine the best EMC mitigation technique, in a more flexible and time efficient way compared to lab testing alone.
  • EMC standards are sometimes ambiguous, which means different test results are achieved if the circuit is tested in different Using simulation allows much faster test changes and results compared to lab testing.
  • The entire system needs to be built to ensure EMC compliance, including cable choice, length, and shielding, as well as measurement Using simulation, real measurement probe effects can be ignored, and cable models can be changed in seconds rather than in hours.
  • The equipment under test can differ from the customer’s installation, leading to different test Using simulation, the real customer application can be better modelled and understood.
  • Existing simulation tools are not unified, and simulation models are not readily available for cables and PCB The virtual lab allows integration of cable, PCB, and passive and active component models, with more accurate results.

What Are the Benefits of System-Level EMC Simulation?

System-level EMC simulation results in much faster time to market for products. This is achieved through:

  • Rapid identification of circuit weaknesses and targeted recommendations for improvement.
  • 99% improvement in capturing EMC failures, and understanding the failure
  • Significant cost savings - several design and test iterations do not need to be performed.
  • Significant time savings - the design does not need to be iterated several times, which cuts down the development schedule by months when you consider the lead time for PCB board layout, manufacture, and assembly.

The EMC Challenge

Several EMC challenges are common in today’s highly integrated sensor system designs. Firstly, modern high density PCB design makes passing EMC tests a difficult task. Shared power and data wire architectures (phantom power) are often used to reduce system cost and PCB area (fewer PCB connectors). The IEPE standard, widely used with vibration sensor technology, supplies a constant current source to the vibration sensor, with the sensor output voltage read back on the same wire, as shown in Figure 2. This 2-wire system means that power supply and data communication lines are subject to the same EMC disturbance, adding additional complexity when designing for EMC. EMC filtering components need to be carefully chosen to mitigate against power supply disturbances, but also must not reduce the data circuit communication bandwidth.

Figure 2. A 2-wire IEPE sensor interface with shared data and power architecture.

Secondly, system-level EMC standards, such as IEC 61000-4-6 conducted RF immunity, are specified for many industrial products, with manufacturers stating product immunity to Class A (no communication errors) or Class B (communication errors, but the system does not need to be reset). The threshold for Class A compliance can vary from manufacturer to manufacturer and is usually identified by a bit error rate (BER), or equivalent microvolt or micro-g range for vibration sensors. The Class A compliance threshold is typically a very low voltage, much lower than the minimum signal that the system can measure. The conducted RF immunity standard allows the user to define pass/fail criteria for the system using a BER, while specifying some setup details and noise injection levels. There is plenty of scope for interpretation in regards to what is the most appropriate setup and BER, and this poses a challenge for the system designer: how to match the lab design verification test setup to the real customer application, particularly when small changes in test setup can yield dramatic changes in test results.

And thirdly, most common EMC test procedures need the full system to be built before going to the EMC certification lab to test it. Full systems include cable choice, length, and shielding. Different cables have different capacitance specifications, which in turn can couple more or less EMC noise into the affected system. Cable length and shield grounding can lead to impedance mismatches at high EMC frequencies as well as different ground current return paths. When a system is built, the preferred test method is that each sub-unit be individually tested for EMC immunity; however, in the real application the entire system will be subjected to the same EMC noise. These are just some of the reasons why it is difficult to correlate factory EMC testing with customer lab tests.

Given today’s highly integrated designs and EMC test complexity, it is clear that a time efficient flexible approach to design for EMC is needed. Simulation before and during lab testing is the answer. Getting the right lab results, with minimum time and effort invested, is the goal.

Using Virtual Lab to Accelerate Debug and Solve EMC Issues

Analog Devices’ system-level expertise and EMC simulation techniques have resulted in the development of a virtual lab simulation flow, as described in Figure 3. A virtual lab environment makes it easier to get design for EMC right the first time, with virtual design iterations performed instead of time-consuming and costly lab setup and measurement iterations. Computing power, SPICE, electromagnetic field simulators, and CAD software have converged and reached a maturity point where this virtual lab is feasible, where engineers can now achieve unprecedented levels of accuracy and simulation speed. PCBs, cables, integrated circuit chips, and passive components can be modelled, as well as EMC stimulus. The results can be analysed, with rapid identification of circuit weaknesses and targeted recommendations for improvement.

Using the virtual lab environment, the designer can access any physical node of the system during the tests without the typical measurement limitations found at the real lab - for example, measurement equipment bandwidth, lab limitations, non-ideal impedances of the probes, and external noise - interfering with the measurements.

Figure 3. Moving from the real lab to virtual lab environment.

Several common industrial IEC 61000 system-level EMC standards tests can be simulated prior to PCB fabrication, as detailed in Table 1.

Table 1. Simulation of Common IEC 61000 Industrial System-Level EMC Standards

MEMS and Simulation Case Study

This section describes a simulation case study and correlation with lab measurements, using the Figure 4 vibration monitoring circuit with Analog Devices’ ADXL1002 MEMS accelerometer. The circuit is compatible with the widely used IEPE interface, as described in Figure 2. The circuit contains two shunt regulators, one of which (IC1) powers the accelerometer and the AD8541 op amp (IC3), and a second (IC4) that provides a 9.5V dc bias. When the system is powered and the ADXL1002 is static, the communication bus rests at 12V dc. The circuit in Figure 3 requires compliance to IEC 61000-4-6 conducted RF immunity, which is a common requirement for equipment operating in industrial applications.

Figure 4. MEMS circuit using ADXL1002 and IEPE-compatible interface.

Correlating real lab and virtual lab simulation requires several process steps, summarized as follows:

1. Real lab setup and simulation environment correlation

2. Develop simulation models using virtual lab (Figure 3)

3. Use simulation to identify design for EMC weaknesses

4. Use simulation to identify design for EMC improvements

5. Validate design for EMC improvements in the real lab

Step 1: Real Lab Setup and Simulation Environment Correlation

The IEC 61000-4-6 conducted RF immunity test is applicable to products that operate in environments where radio frequency (RF) fields are present. The RF fields can act on the entire length of cables connected to installed equipment. In the IEC 61000-4-6 test, an RF voltage is stepped from 150kHz to 80MHz. The RF voltage is 80% amplitude modulated (AM) by a 1kHz sinusoidal wave. The IEC 61000-4-6 standard specifies Level 3 as the highest RF voltage at 10V/m. The RF voltage is injected to the cable shield, or capacitively coupled using a clamp.

As shown in Table 2, several key parameters need to be correlated between the virtual and real lab environment:

  • Test level and IEC EMC standard (amplitude, frequency)
  • Cable specification (length, capacitance, shielding)
  • System grounding (including cable shield)
  • Measured parameters (what and where in the circuit)
  • Test pass/fail threshold (amplitude, frequency)

Table 2. Real Lab Setup and Simulation Environment Correlation

Step 2: Develop Simulation Models Using Virtual Lab

Typically, SPICE models are readily available for most active and passive circuit components. Electromagnetic simulators can model other nonstandard components, such as PCB geometry and nets, as well as cable models.

The information gathered in Table 2 helps to ensure accurate modelling of cable parameters. This system uses a 2-core shielded cable, which comes at a cost premium compared to an unshielded cable. Having no cable shield makes the system weaker from an EMC point of view. Simulation with an unshielded cable shows significant additional EMC noise compared to a shielded cable system.

The MEMS IEPE circuit, shown in Figure 4, is designed to be as compact as possible (1.9cm × 1.9cm) and uses just two PCB layers. Using a 2-layer PCB increases potential EMC issues due to higher coupling capacitances and crosstalk, so careful design is a must.

At this point, the system design engineer can start extracting the models for the PCB and cables, using electromagnetic simulation tools, and link those to the SPICE models of the ICs and passive components. Now a SPICE simulation can be performed, and EMC stimulus can interact at the system level. Figure 5 shows the electromagnetic simulation model for the PCB physical geometry and nets, and the 2-core shielded cable. The 3-dimensional PCB SPICE model is a complete abstraction of the PCB physical layout. The 3D PCB SPICE model includes many pins that can be used to connect to the MEMS, op amp, and shunt regulator SPICE models. In this way, an extremely accurate electrical simulation can be performed. Passive component values (capacitor, resistor, inductors) can be changed, and the system resonances can be observed and rectified in a more time efficient and flexible manner compared to changing and testing real hardware. The cable SPICE model can be modified during testing - for example, the cable length can be increased or decreased, which can have a significant effect on EMC coupling and system performance.

Once the EMC time domain simulation is finished, engineers can analyse the circuit transient responses across time and frequency. Depending on the type of EMC test, transient or frequency analysis must be done. Examples of transient analysis can be conducted immunity tests, and examples of frequency domain are radiated emissions EMC tests (see Table 1 for more information).

Figure 5. Electromagnetic simulation model for the PCB physical geometry and nets, as well as the 2-core shielded cable.

Step 3: Use Simulation to Identify Design for EMC Weaknesses

The failure mechanisms were easy to find once the full system was modelled and simulated. The EMC noise voltage is injected into the cable shield. The noise voltage is then coupled through parasitic capacitance between cable shield and wire cores. The noise is directed toward the ACC node on the PCB, as shown in Figure 6. The noise current path follows the path of least impedance, in this case through capacitor C8 to the op amp output. The op amp saturates as a result, sinking high current out of the power supply (VDD) node. The IC1 VDD regulator cannot supply this high current; therefore, the VDD voltage drops. The VDD voltage drop temporarily shuts down the MEMS sensor (powered at 5V nominal), resulting in voltage ripple at op amp output (noise).

Figure 6. Circuit failure mechanism.

A second failure mode was identified, which would be either difficult or impossible to observe and debug using lab testing alone. High frequency transmission lines are usually terminated with a load that matches the transmission cable impedance. The IEPE cable is typically unterminated due to low frequency (kilohertz) data communication. However, when the EMC noise is injected in the 60MHz to 70MHz range, noise voltages are reflected on the communication bus as the cable is not terminated with a matching load.

Step 4: Use Simulation to Identify Design for EMC Improvements

The goal is to determine the least costly and most effective circuit changes for EMC mitigation. The two EMC issues can be resolved by adding two capacitors, as shown in Figure 7. The 22nF CEMC directs the noise away from the sensitive circuitry (op amp, MEMS), with the noise current now shunted to ground via the C1 capacitor as shown. A ferrite bead, with high impedance at 100MHz frequencies, can be added for extra insurance to block any residual noise. The CTERM shunts cable reflections at high frequency during EMC testing.

Figure 7. Design for EMC improvements.

As described in Step 3, the VDD power net failure is a reliable indicator of EMC susceptibility. Figure 8 shows the voltage drop in the VDD power net where the CEMC is not used. The simulation predicts approximately 2V drop, or larger. When CEMC is used, the deviation from nominal is in the microvolt range, which is much lower than the target compliance threshold of 1.6mV.

Figure 8. Simulated VDD power net with CEMC capacitor (green waveforms) and without CEMC (blue waveforms).

Analog Devices’ ADXL1002 MEMS sensor has a 3db bandwidth of 11kHz, so the selection of the CEMC and CTERM is critical in order to preserve the 11kHz communication bus. Using the virtual lab flexibility, many capacitance values were simulated, and two optimum capacitance values were selected. After adding these capacitors, the system is predicted to meet the EMC pass criteria of less than 1.6mV of noise voltage.

Step 5: Validate Design for EMC Improvements in the Real Lab

The original circuit, as described in Figure 4, was lab tested using the Table 2 parameters. The result was a gross failure of 912mV of noise at a 77MHz test frequency.

Following the Step 4 recommendations, a 22nF capacitor (CEMC) was added in parallel with resistor R3. This resulted in a 99% improvement, with less than 6mV noise measured, as shown in the Figure 9 lab test result (blue waveform).

To achieve the design target of less than 1.6mV of noise, a 100nF CTERM was added between the ACC and GND nodes, as well as the CEMC 22nF. Figure 9 shows the green simulation result with the noise curve flattened across the broad 0.15MHz to 80MHz spectrum.

Figure 9. Simulation and lab test results following virtual lab recommendations.

Once the results and targets are achieved, it is possible to determine which part of the system is the weakest link from an EMC point of view. In this case, the cable is the main contributor as it couples the EMC energy from the source to the circuit and causes reflections due to its length and termination impedance at higher frequencies. The two capacitors (CTERM and CEMC) were able to shunt the two noise sources to the cable to ground effectively. Alternative solutions and approaches, such as it replacing the op amp, are unrealistic. Replacing the op amp with an ultralow output impedance op amp is a poor choice, as lower output impedance devices have inherently higher power consumption, which affects the competitiveness of the overall design.

Conclusion

Simulating the entire system gives unprecedented insights into how the circuit behaves under EMC stress and is the best way to solve complex EMC problems. Time to market can be dramatically reduced when this methodology is used. Greater than 99% improvement in design for EMC was achieved using the process flow described in this article, which is summarised in Figure 10.

Figure 10. Process flow for greater than 99% improvement in EMC performance.

About the Author

Richard Anslow is a system applications engineer with the Connected Motion and Robotics Team within the Automation and Energy Business Unit at Analog Devices. His areas of expertise are condition-based monitoring and industrial communication design. He received his B.Eng. and M.Eng. degrees from the University of Limerick, Limerick, Ireland. He can be reached at richard.anslow@analog.com.

Ricardo Zaplana holds a master’s degree in telecommunications and microelectronics from Universidad de Valencia, Spain. He has over 20 years of microelectronic design experience in areas of power management, interface, and isolation products. Ricardo now focuses on high speed isolators, isolated power, and EMC simulation, in the area of radiated emissions and conducted immunity. He can be reached at ricardo.zaplana@analog.com.

Tue, 27 Sep 2022 05:15:00 -0500 en text/html https://www.theengineer.co.uk/content/product/achieving-99-improvement-in-emc-compliance-for-mems-systems
Killexams : Epoxy Molding Compounds (EMC) for IGBT Market Trends, Business Overview, Industry Growth, and Forecast 2022 To 2028

The MarketWatch News Department was not involved in the creation of this content.

Sep 21, 2022 (The Expresswire) -- Number of Tables and Figures :151 | The global "Epoxy Molding Compounds (EMC) for IGBT Market"size is projected to reach Multimillion USD by 2028, In comparison to 2021, at unexpected CAGR during 2022-2028 and generated magnificent revenue. The market is segmented on the basis of End-user Industry (600V-1200V IGBT, Above 1200V IGBT), By Type (Normal Epoxy Molding Compound, Green Epoxy Molding Compound), and Geography (Asia-Pacific, North America, Europe, South America, and Middle-East and Africa).

Epoxy Molding Compounds (EMC) for IGBT Market Research Report is spread across 109 Pages and provides exclusive data, information, vital statistics, trends, and competitive landscape details in this niche sector.

Market Analysis and Insights: Global Epoxy Molding Compounds (EMC) for IGBT Market

Due to the COVID-19 pandemic, the global Epoxy Molding Compounds (EMC) for IGBT market size is estimated to be worth USD million in 2022 and is forecast to a readjusted size of USD million by 2028 with a Impressive CAGR during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Normal Epoxy Molding Compound accounting for % of the Epoxy Molding Compounds (EMC) for IGBT global market in 2021, is projected to value USD million by 2028, growing at a revised % CAGR from 2022 to 2028. While 600V-1200V IGBT segment is altered to an % CAGR throughout this forecast period.

North America Epoxy Molding Compounds (EMC) for IGBT market is estimated at USD million in 2021, while Europe is forecast to reach USD million by 2028. The proportion of the North America is % in 2021, while Europe percentage is %, and it is predicted that Europe share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.

The global major manufacturers of Epoxy Molding Compounds (EMC) for IGBT include Kyocera, KCC, Sumitomo Bakelite, SHOWA DENKO MATERIALS, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Samsung SDI and Eternal Materials, etc. In terms of revenue, the global 3 largest players have a % market share of Epoxy Molding Compounds (EMC) for IGBT in 2021.

Global Epoxy Molding Compounds (EMC) for IGBT Market: Drivers and Restrains

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Epoxy Molding Compounds (EMC) for IGBT Market: Segment Analysis

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

Get a sample PDF of report -https://www.360researchreports.com/enquiry/request-sample/21442885

COVID-19 IMPACT ON MARKET

The outbreak of COVID-19 has severely impacted the overall supply chain of the Epoxy Molding Compounds (EMC) for IGBT market. The halt in production and end use sector operations have affected the Epoxy Molding Compounds (EMC) for IGBT market. The pandemic has affected the overall growth of the industry In 2020 and at the start of 2021, Sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations resulting in disruptions in import and export activities of Epoxy Molding Compounds (EMC) for IGBT.

COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets. Our analysts monitoring the situation across the globe explains that the market will generate remunerative prospects for producers post COVID-19 crisis. The report aims to provide an additional illustration of the latest scenario, economic slowdown, and COVID-19 impact on the overall industry.

Final Report will add the analysis of the impact of COVID-19 on this industry.

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Who are the key Players in the Epoxy Molding Compounds (EMC) for IGBT market?

● Kyocera
● KCC
● Sumitomo Bakelite
● SHOWA DENKO MATERIALS
● Chang Chun Group
● Hysol Huawei Electronics
● Panasonic
● Samsung SDI
● Eternal Materials
● Jiangsu Zhongpeng New Material
● Shin-Etsu Chemical
● Hexion
● Nepes
● Tianjin Kaihua Insulating Material
● HHCK
● Scienchem
● Beijing Sino-tech Electronic Material

Epoxy Molding Compounds (EMC) for IGBT Market Development Strategy Pre and Post COVID-19, by Corporate Strategy Analysis, Landscape, Type, Application, and Leading 20 Countries covers and analyzes the potential of the global Epoxy Molding Compounds (EMC) for IGBT industry, providing statistical information about market dynamics, growth factors, major challenges, PEST analysis and market entry strategy Analysis, opportunities and forecasts. The biggest highlight of the report is to provide companies in the industry with a strategic analysis of the impact of COVID-19. At the same time, this report analyzed the market of leading 20 countries and introduce the market potential of these countries.

It also provides accurate information and cutting-edge analysis that is necessary to formulate an ideal business plan, and to define the right path for rapid growth for all involved industry players. With this information, stakeholders will be more capable of developing new strategies, which focus on market opportunities that will benefit them, making their business endeavors profitable in the process.

Get a sample Copy of the Epoxy Molding Compounds (EMC) for IGBT Market Report 2022

Epoxy Molding Compounds (EMC) for IGBT Market 2022 is segmented as per type of product and application. Each segment is carefully analyzed for exploring its market potential. All of the segments are studied in detail on the basis of market size, CAGR, market share, consumption, revenue and other vital factors.

Which product segment is expected to garner highest traction within the Epoxy Molding Compounds (EMC) for IGBT Market In 2022:

● Normal Epoxy Molding Compound
● Green Epoxy Molding Compound

Which are the key drivers supporting the growth of the Epoxy Molding Compounds (EMC) for IGBT market?

● 600V-1200V IGBT
● Above 1200V IGBT

Which region is expected to hold the highest market share in the Epoxy Molding Compounds (EMC) for IGBT Market?

● North America (United States, Canada and Mexico) ● Europe (Germany, UK, France, Italy, Russia and Turkey etc.) ● Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam) ● South America (Brazil, Argentina, Columbia etc.) ● Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

This Epoxy Molding Compounds (EMC) for IGBT Market Research/Analysis Report Contains Answers to your following Questions

● Which Manufacturing Technology is used for Epoxy Molding Compounds (EMC) for IGBT? What Developments Are Going On in That Technology? Which Trends Are Causing These Developments? ● Who Are the Global Key Players in This Epoxy Molding Compounds (EMC) for IGBT Market? What are Their Company Profile, Their Product Information, and Contact Information? ● What Was Global Market Status of Epoxy Molding Compounds (EMC) for IGBT Market? What Was Capacity, Production Value, Cost and PROFIT of Epoxy Molding Compounds (EMC) for IGBT Market? ● What Is Current Market Status of Epoxy Molding Compounds (EMC) for IGBT Industry? What’s Market Competition in This Industry, Both Company, and Country Wise? What’s Market Analysis of Epoxy Molding Compounds (EMC) for IGBT Market by Taking Applications and Types in Consideration? ● What Are Projections of Global Epoxy Molding Compounds (EMC) for IGBT Industry Considering Capacity, Production and Production Value? What Will Be the Estimation of Cost and Profit? What Will Be Market Share, Supply and Consumption? What about Import and Export? ● What Is Epoxy Molding Compounds (EMC) for IGBT Market Chain Analysis by Upstream Raw Materials and Downstream Industry? ● What Is Economic Impact On Epoxy Molding Compounds (EMC) for IGBT Industry? What are Global Macroeconomic Environment Analysis Results? What Are Global Macroeconomic Environment Development Trends? ● What Are Market Dynamics of Epoxy Molding Compounds (EMC) for IGBT Market? What Are Challenges and Opportunities? ● What Should Be Entry Strategies, Countermeasures to Economic Impact, and Marketing Channels for Epoxy Molding Compounds (EMC) for IGBT Industry?

Our research analysts will help you to get customized details for your report, which can be modified in terms of a specific region, application or any statistical details. In addition, we are always willing to comply with the study, which triangulated with your own data to make the market research more comprehensive in your perspective.

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Major Points from Table of Contents:

Global Epoxy Molding Compounds (EMC) for IGBT Market Research Report 2022-2026, by Manufacturers, Regions, Types and Applications

1 Epoxy Molding Compounds (EMC) for IGBT Market Overview

1.1 Product Overview and Scope of Epoxy Molding Compounds (EMC) for IGBT
1.2 Epoxy Molding Compounds (EMC) for IGBT Segment by Type
1.2.1 Global Epoxy Molding Compounds (EMC) for IGBT Market Size Growth Rate Analysis by Type 2022 VS 2028
1.3 Epoxy Molding Compounds (EMC) for IGBT Segment by Application
1.3.1 Global Epoxy Molding Compounds (EMC) for IGBT Consumption Comparison by Application: 2022 VS 2028
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Molding Compounds (EMC) for IGBT Revenue Estimates and Forecasts (2017-2028)
1.4.2 Global Epoxy Molding Compounds (EMC) for IGBT Production Estimates and Forecasts (2017-2028)
1.5 Global Market Size by Region
1.5.1 Global Epoxy Molding Compounds (EMC) for IGBT Market Size Estimates and Forecasts by Region: 2017 VS 2021 VS 2028
1.5.2 North America Epoxy Molding Compounds (EMC) for IGBT Estimates and Forecasts (2017-2028)
1.5.3 Europe Epoxy Molding Compounds (EMC) for IGBT Estimates and Forecasts (2017-2028)
1.5.4 China Epoxy Molding Compounds (EMC) for IGBT Estimates and Forecasts (2017-2028)
1.5.5 Japan Epoxy Molding Compounds (EMC) for IGBT Estimates and Forecasts (2017-2028)

2 Market Competition by Manufacturers
2.1 Global Epoxy Molding Compounds (EMC) for IGBT Production Market Share by Manufacturers (2017-2022)
2.2 Global Epoxy Molding Compounds (EMC) for IGBT Revenue Market Share by Manufacturers (2017-2022)
2.3 Epoxy Molding Compounds (EMC) for IGBT Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.4 Global Epoxy Molding Compounds (EMC) for IGBT Average Price by Manufacturers (2017-2022)
2.5 Manufacturers Epoxy Molding Compounds (EMC) for IGBT Production Sites, Area Served, Product Types
2.6 Epoxy Molding Compounds (EMC) for IGBT Market Competitive Situation and Trends
2.6.1 Epoxy Molding Compounds (EMC) for IGBT Market Concentration Rate
2.6.2 Global 5 and 10 Largest Epoxy Molding Compounds (EMC) for IGBT Players Market Share by Revenue
2.6.3 Mergers and Acquisitions, Expansion

3 Production by Region
3.1 Global Production of Epoxy Molding Compounds (EMC) for IGBT Market Share by Region (2017-2022)
3.2 Global Epoxy Molding Compounds (EMC) for IGBT Revenue Market Share by Region (2017-2022)
3.3 Global Epoxy Molding Compounds (EMC) for IGBT Production, Revenue, Price and Gross Margin (2017-2022)
3.4 North America Epoxy Molding Compounds (EMC) for IGBT Production
3.4.1 North America Epoxy Molding Compounds (EMC) for IGBT Production Growth Rate (2017-2022)
3.4.2 North America Epoxy Molding Compounds (EMC) for IGBT Production, Revenue, Price and Gross Margin (2017-2022)
3.5 Europe Epoxy Molding Compounds (EMC) for IGBT Production
3.5.1 Europe Epoxy Molding Compounds (EMC) for IGBT Production Growth Rate (2017-2022)
3.5.2 Europe Epoxy Molding Compounds (EMC) for IGBT Production, Revenue, Price and Gross Margin (2017-2022)
3.6 China Epoxy Molding Compounds (EMC) for IGBT Production
3.6.1 China Epoxy Molding Compounds (EMC) for IGBT Production Growth Rate (2017-2022)
3.6.2 China Epoxy Molding Compounds (EMC) for IGBT Production, Revenue, Price and Gross Margin (2017-2022)
3.7 Japan Epoxy Molding Compounds (EMC) for IGBT Production
3.7.1 Japan Epoxy Molding Compounds (EMC) for IGBT Production Growth Rate (2017-2022)
3.7.2 Japan Epoxy Molding Compounds (EMC) for IGBT Production, Revenue, Price and Gross Margin (2017-2022)

4 Global Epoxy Molding Compounds (EMC) for IGBT Consumption by Region
4.1 Global Epoxy Molding Compounds (EMC) for IGBT Consumption by Region
4.1.1 Global Epoxy Molding Compounds (EMC) for IGBT Consumption by Region
4.1.2 Global Epoxy Molding Compounds (EMC) for IGBT Consumption Market Share by Region
4.2 North America
4.2.1 North America Epoxy Molding Compounds (EMC) for IGBT Consumption by Country
4.2.2 U.S.
4.2.3 Canada
4.3 Europe
4.3.1 Europe Epoxy Molding Compounds (EMC) for IGBT Consumption by Country
4.3.2 Germany
4.3.3 France
4.3.4 U.K.
4.3.5 Italy
4.3.6 Russia
4.4 Asia Pacific
4.4.1 Asia Pacific Epoxy Molding Compounds (EMC) for IGBT Consumption by Region
4.4.2 China
4.4.3 Japan
4.4.4 South Korea
4.4.5 China Taiwan
4.4.6 Southeast Asia
4.4.7 India
4.4.8 Australia
4.5 Latin America
4.5.1 Latin America Epoxy Molding Compounds (EMC) for IGBT Consumption by Country
4.5.2 Mexico
4.5.3 Brazil

Get a sample Copy of the Epoxy Molding Compounds (EMC) for IGBT Market Report 2022

5 Segment by Type
5.1 Global Epoxy Molding Compounds (EMC) for IGBT Production Market Share by Type (2017-2022)
5.2 Global Epoxy Molding Compounds (EMC) for IGBT Revenue Market Share by Type (2017-2022)
5.3 Global Epoxy Molding Compounds (EMC) for IGBT Price by Type (2017-2022)
6 Segment by Application
6.1 Global Epoxy Molding Compounds (EMC) for IGBT Production Market Share by Application (2017-2022)
6.2 Global Epoxy Molding Compounds (EMC) for IGBT Revenue Market Share by Application (2017-2022)
6.3 Global Epoxy Molding Compounds (EMC) for IGBT Price by Application (2017-2022)

7 Key Companies Profiled
7.1 Information
7.1.2 Product Portfolio
7.1.3 Production, Revenue, Price and Gross Margin (2017-2022)
7.1.4 Main Business and Markets Served
7.1.5 exact Developments/Updates

8 Epoxy Molding Compounds (EMC) for IGBT Manufacturing Cost Analysis
8.1 Epoxy Molding Compounds (EMC) for IGBT Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of Epoxy Molding Compounds (EMC) for IGBT
8.4 Epoxy Molding Compounds (EMC) for IGBT Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 Epoxy Molding Compounds (EMC) for IGBT Distributors List
9.3 Epoxy Molding Compounds (EMC) for IGBT Customers

10 Market Dynamics
10.1 Epoxy Molding Compounds (EMC) for IGBT Industry Trends
10.2 Epoxy Molding Compounds (EMC) for IGBT Market Drivers
10.3 Epoxy Molding Compounds (EMC) for IGBT Market Challenges
10.4 Epoxy Molding Compounds (EMC) for IGBT Market Restraints

11 Production and Supply Forecast
11.1 Global Forecasted Production of Epoxy Molding Compounds (EMC) for IGBT by Region (2023-2028)
11.2 North America Epoxy Molding Compounds (EMC) for IGBT Production, Revenue Forecast (2023-2028)
11.3 Europe Epoxy Molding Compounds (EMC) for IGBT Production, Revenue Forecast (2023-2028)
11.4 China Epoxy Molding Compounds (EMC) for IGBT Production, Revenue Forecast (2023-2028)
11.5 Japan Epoxy Molding Compounds (EMC) for IGBT Production, Revenue Forecast (2023-2028)

12 Consumption and Demand Forecast
12.1 Global Forecasted Demand Analysis of Epoxy Molding Compounds (EMC) for IGBT
12.2 North America Forecasted Consumption of Epoxy Molding Compounds (EMC) for IGBT by Country
12.3 Europe Market Forecasted Consumption of Epoxy Molding Compounds (EMC) for IGBT by Country
12.4 Asia Pacific Market Forecasted Consumption of Epoxy Molding Compounds (EMC) for IGBT by Region
12.5 Latin America Forecasted Consumption of Epoxy Molding Compounds (EMC) for IGBT by Country

13 Forecast by Type and by Application (2023-2028)
13.1 Global Production, Revenue and Price Forecast by Type (2023-2028)
13.1.1 Global Forecasted Production of Epoxy Molding Compounds (EMC) for IGBT by Type (2023-2028)
13.1.2 Global Forecasted Revenue of Epoxy Molding Compounds (EMC) for IGBT by Type (2023-2028)
13.1.3 Global Forecasted Price of Epoxy Molding Compounds (EMC) for IGBT by Type (2023-2028)
13.2 Global Forecasted Consumption of Epoxy Molding Compounds (EMC) for IGBT by Application (2023-2028)
13.2.1 Global Forecasted Production of Epoxy Molding Compounds (EMC) for IGBT by Application (2023-2028)
13.2.2 Global Forecasted Revenue of Epoxy Molding Compounds (EMC) for IGBT by Application (2023-2028)
13.2.3 Global Forecasted Price of Epoxy Molding Compounds (EMC) for IGBT by Application (2023-2028)

14 Research Finding and Conclusion

15 Methodology and Data Source
15.1 Methodology/Research Approach
15.1.1 Research Programs/Design
15.1.2 Market Size Estimation
15.1.3 Market Breakdown and Data Triangulation
15.2 Data Source
15.2.1 Secondary Sources
15.2.2 Primary Sources
15.3 Author List
15.4 Disclaimer

Continued...

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Tue, 20 Sep 2022 16:52:00 -0500 en-US text/html https://www.marketwatch.com/press-release/epoxy-molding-compounds-emc-for-igbt-market-trends-business-overview-industry-growth-and-forecast-2022-to-2028-2022-09-21
Killexams : Recovery specialist uses his story to help those struggling with addiction get back on track

Monday, September 19, 2022

ATLANTIC CITY, N.J. -- More than 20 years ago, Vinnie Kirkland was incarcerated for issues related to drug use.

He vowed that when he was released, he was going to change his life.

Fast forward to 2022, and Vinnie is now a recovery specialist at AtlantiCare, a hospital system in New Jersey.

Based in Atlantic City, Kirkland now reaches out to people struggling with addiction in his hometown.

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Vinnie's message is that there is hope for everybody, as long as they are willing to be helped.

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Killexams : Baldwin EMC latest to send relief to south Florida

SUMMERDALE, Ala. (WALA) - Baldwin EMC is the latest electric cooperative from our area to send crews to south Florida to help with disaster recovery. A crew of 20 pulled out shortly after 2:00 p.m. Monday, October 3, 2022.

The decision was made Monday morning to hit the road after a call came in from Lee County Electric Cooperative. Lee County was hit the hardest by Hurricane Ian and Baldwin EMC has a mutual aid agreement with them. Sixty-eight percent of the cooperative’s customers are still without power there.

Baldwin EMC sent 20 crew members to assist Lee County Electric Cooperative in south Florida(Hal Scheurich)

“They were impacted greatly. They have a lot of fallen power lines, fallen power poles, broken transformers, so they have the work cut out for them over the next several days,” said Mark Ingram with Baldwin EMC.

Baldwin EMC sent people with various skill sets and equipment to help restore power to parts of Lee County and the surrounding area. They pulled out of the Summerdale office with a sendoff from many of their fellow employees and will be gone for at least a week.

“Of the twenty employees that we have going, it consists of linemen. It consists of right-of-way personnel and it also consists of a mechanic and one superintendent as far as the lead,” Ingram said.

Fairhope Utilities sent out a crew to Florida before Hurricane Ian even made landfall. Those workers staged in Gainesville and have since been working in the Wauchula area.

Riviera Utilities also sent out crews last week as well. Sixteen people left Friday morning and have been focusing on the Lakeland area. Chief Engineer, Scott Sligh said they first focused on rebuilding main lines and have now moved to residential service.

“They are going block by block, working and the lines are actually all behind the houses which really slows things down because it’s a lot of climbing that they have to do…a lot of manual work so it’s much slower but that’s what they’re doing now,” Sligh explained.

Riviera’s workers could be back within the week. Sligh said a typical day for his guys begins at 5 a.m., with lunch and snacks in the field and the day’s work often doesn’t end until 9 o’clock at night.

---

Download the FOX10 Weather App. Get life-saving severe weather warnings and alerts for your location no matter where you are. Available free in the Apple App Store and the Google Play Store.

Mon, 03 Oct 2022 06:34:00 -0500 en text/html https://www.fox10tv.com/2022/10/03/baldwin-emc-latest-send-relief-south-florida/
Killexams : Des Moines-based EMC Insurance Co. announces planned job cuts as it exits reinsurance business

desmoinesregister.com cannot provide a good user experience to your browser. To use this site and continue to benefit from our journalism and site features, please upgrade to the latest version of Chrome, Edge, Firefox or Safari.

Tue, 27 Sep 2022 13:24:00 -0500 en-US text/html https://www.desmoinesregister.com/story/money/business/2022/09/27/des-moines-emc-insurance-co-announces-exit-reinsurance-business-65-job-cuts/10444926002/
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