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Exam Code: 4A0-M01 Practice exam 2023 by team
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The latest iteration of a legacy

Founded at the Massachusetts Institute of Technology in 1899, MIT Technology Review is a world-renowned, independent media company whose insight, analysis, reviews, interviews and live events explain the latest technologies and their commercial, social and political impact.

Thu, 21 Oct 2021 21:13:00 -0500 en text/html
Killexams : Orthopaedic Examination Techniques

Orthopaedic Examination Techniques comprehensively covers the basic examination skills and key special tests needed to evaluate the adult and paediatric musculoskeletal system. Chapters are presented in a clear and logical way to allow readers to understand then master the techniques of orthopaedic clinical examination. Written by a diverse group of chapter authors with extensive experience in teaching clinical examination and who use a uniform system that is taught on national courses, every aspect of musculoskeletal examination is covered in the adult and paediatric patient. Numerous illustrations and new clinical photographs help readers to visualise and understand the key techniques, and five new chapters at the end of the book demonstrate the value of clinical examination through more than 80 clinical case examples. Easy-to-follow throughout, this book is invaluable reading for trainee orthopaedic surgeons, especially those preparing for the FRCS (Tr&Orth) postgraduate examination, practising orthopaedic surgeons, medical students, physiotherapists, and rheumatologists.

Thu, 01 Jul 2021 10:55:00 -0500 en text/html
Killexams : Power Reduction Techniques

Are they all the same for established planar, FD-SOI and finFET transistors?

As 16nm and 14nm finFET process nodes come into production toward the end of this year, the performance (up to 30% vs. 28nm planar CMOS), power (~30%) and area (up to ~50%) benefits have been well documented. The same can be said for the 28nm FD-SOI process as it gains more traction in the marketplace touting similar performance and power improvements as those for FinFET when compared against its planar cousin.

But are various power optimization techniques for the established process nodes (e.g. 28nm and above) also applicable to the smaller non-planar geometries, or will newer methods need to be deployed? Even with moving from larger to smaller process nodes, such as 90nm to 28nm, power savings that can be achieved vary greatly.

A quick overview of techniques broken down into leakage, dynamic and multi-voltage (MV) can be viewed in Figure 1 below. Note that even though the MV techniques do help with dynamic power (e.g. low VDD operation) and leakage (e.g. shutdown), we tend to categorize them on their own since these are more advanced techniques that are controlled by power intent such as UPF.



Figure 1: Overview of Power Saving Techniques

In general, most of the techniques that are used for established planar process nodes today also apply to the smaller process geometries (e.g. FinFET and FD-SOI). For example, clock gating and clock tree synthesis do provide dynamic power savings across all process nodes. However, a technique such as lower VDD operation is much more effective for the FinFET and FD-SOI processes because they have much lower voltage thresholds where transistors can operate all the way down to 0.5V (and lower), providing significant dynamic power savings (at the expense of performance).  Operation at lower voltages also makes DVFS and AVS deployment much more practical.

Reverse biasing generally is used for putting designs into standby mode, resulting in leakage savings. It was particularly effective for the larger established process nodes, providing savings of about 2X for 65nm (and greater than that for even larger processes). But it wasn’t scalable to smaller planar technologies where leakage savings reduced to only 5%-10% at 40nm, and less than 5% at 28nm. With extra routing resources required for tapping the wells, a less than 5% savings was generally not worth the tradeoff. Biasing is not an option for the 16/14nm and below FinFET process. However, biasing became viable again for the FD-SOI process where the insulator creates a buried gate below the channel, effectively providing a “vertical double gate,” providing the ability to trade off faster transistor performance (active body biasing) with reportedly up to 10X lower leakage (reverse biasing) at 28nm.

Another difference to note is that although multi-Vt (e.g. high-Vt, low-Vt) options are generally available for almost all process nodes, the number of Vt options do vary by the node. Theoretically, FinFET shouldn’t require Vt options, but there are a couple of foundries that plan to offer them, although they are going back to supply just three or four Vt options as opposed to the five or six available for the more established process nodes.

Lastly, channel-length variants, which became a standard offering at the 40nm planar nodes, are also offered for FD-SOI and FinFET processes. These are particularly effective for performing leakage recovery, or even reducing the number of Vt options used based on the target performance and power targets. The techniques and their applicability to the process nodes are summarized in Figure 2.



Figure 2: Applicability of Power Savings Techniques for Process Nodes

How applicable are all of these techniques for specific applications? Figure 3 shows the data collected from the annual Synopsys’ Global User Survey (GUS) indicating deployment of a technique across low power applications.



Figure 3: Use of Low Power Techniques across Application Markets

So when is it time move to smaller process geometries? From Synopsys’ GUS data collected from designers that made the move to FinFET, respondents indicated that their primary reason to move is for performance. But dynamic power saving and ability to operate at lower VDD were also attractive options (see Figure 4).



Figure 4: Primary Reason for Moving to FinFET

In summary, low power techniques are generally applicable across all process nodes, but the amount of real savings will vary. As process geometries get smaller, some techniques are no longer applicable (e.g. biasing for 28nm) while newer techniques become more practical (e.g. low VDD and DVFS).

Mary Ann White

  (all posts)
Mary Ann White is director of product marketing for the Galaxy Design Platform at Synopsys.
Sun, 06 Aug 2023 12:00:00 -0500 en-US text/html
Killexams : Why Alcatel-Lucent (ALU) Stock Hit a One-Year Low Today No result found, try new keyword!Shares of Alcatel-Lucent (ALU) hit a one-year low Thursday as the IP and cloud networking provider suffered from a continuing decline in the telecommunications sector. Shares of Alcatel-Lucent ... Tue, 18 Jul 2023 12:00:00 -0500 text/html Killexams : Baki: 10 Deadliest Techniques No result found, try new keyword!The fighters in Baki use unique, devastating techniques to gain the upper hand in fights against their opponents. Baki, the legendary manga and anime series, begins on an enthralling trip into the ... Sun, 13 Aug 2023 14:30:00 -0500 Killexams : Naruto: Sasuke's 23 Best Jutsus/Techniques No result found, try new keyword!Sasuke learns plenty of jutsus and techniques throughout the series, even developing some of his own. These are the cream of the crop! Sasuke Uchiha is an incredibly powerful shinobi with a wide ... Mon, 07 Aug 2023 13:32:00 -0500 Killexams : How to unfreeze a frozen Alcatel Idol 5s (easy steps) No result found, try new keyword!Being one of the entry-level devices with decent hardware specs, the Alcatel Idol 5s is popular to those who are in a tight budget. The thing about cheap phones is that you may encounter more ... Thu, 03 Aug 2023 16:18:00 -0500 en-US text/html Killexams : Genetic techniques articles from across Nature Portfolio

The large size of nucleases of commonly used CRISPR-Cas systems reduces the delivery efficiency of these gene-editing tools for therapeutic applications. Now, the cryo-electron microscopy structure of the miniature Acidibacillus sulfuroxidans Cas12f1 reveals the determinants for its activity despite its small size.

  • Zhaowei Wu
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Sun, 02 Jan 2022 19:58:00 -0600 en text/html
Killexams : Alcatel Jitterbug Smart

Info Photos News Forum  

This smartphone for older users sports a huge 5.5-inch screen. Its unique software offers simple menus with large text, plus GreatCall's extensive suite of services for older users. It also offers full Android functionality at a low price. Other features include 3.5mm audio jack and front and rear cameras.

This phone is not currently available from any major U.S. carrier. It is compatible with some U.S. networks, and may be available from third-party dealers or smaller, regional carriers.


Compare side-by-side vs...
Display 5.5 in   diagonal, 16:9
HD   720 x 1280 pixels
267 ppi   approx.
Battery 2,500 mAh
Talk: 6.5 hours max.
Standby: 250 hours max.
Processor Qualcomm Snapdragon 210   MSM8909
1.1 GHz
Storage 8 GB raw hardware
4 GB available to user
Expandable via memory card

5 megapixel
LED flash
HDR, panorama, code scanner modes

Video: 720p HD

Front Camera 2 megapixel
Weight 6.1 oz   173 g
Dimensions 6 x 3.1 x 0.4 in   152 x 79 x 10.2 mm
OS / Platform Android version 5.1
Network Bands

4G LTE: 4, 13

CDMA: 850, 1900

LTE   4G
band 4 / 1700 MHz   AWS (Americas)
band 13 / 750 MHz   Upper 700 (USA (Verizon))

CDMA   2G / 3G
band 5 / BC0 / 850 MHz   Cellular (Americas, Oceania, Brazil, Israel)
band 2 / BC1 / 1900 MHz   PCS (Americas)

Data Technology LTE (Cat 4)
SIM card size Micro   3FF

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Ungroup Features   Show all features Key features only
Barometer -
Fingerprint Reader -
Flashlight Yes
Ruggedized -
VR-ready -
Water-Resistant -
Hearing Aid Compatible Rating: M4, T4 (very tele-coil compatible)
TTY/TDD (Digital) Yes
Extra Display -
Ringer Profiles -
Bluetooth Supported Profiles: HSP 1.2, HFP 1.6, OPP, FTP, PBA, A2DP 1.2, AVRC 1.5, HID, PAN, SAP 1.1, MAP
version 4.0
Infrared (IR) -
MirrorLink -
USB Connector: Micro-USB
Wi-Fi Version: 4 (802.11 b,g,n)
Changeable Body Plates -
Data & Network
Dual-SIM -
Satellite -
Side Keys lock, volume on right
Stylus -
Text Keyboard, Hardware -
Touch Screen Type: Capacitive
Memory Card Slot Card Type: microSD
up to 32 GB
FM Radio Yes
Headphone Jack (3.5mm) Yes
Stereo Speakers -
Photo & Video
Miracast -
TV Output -
Fast Charging -
Wireless Charging -
Call Screening -
HD Voice Yes
Push-To-Talk -
Speaker Phone Type: Full-duplex
Mon, 21 Aug 2023 12:00:00 -0500 en-US text/html
Killexams : How to fix Alcatel Idol 5S that won’t turn on (easy steps) No result found, try new keyword!We have some readers that own the Alcatel Idol 5S that contacted us about a problem wherein their devices reportedly turned off by themselves and would no longer respond or turn on. The screen are ... Fri, 04 Aug 2023 13:00:00 -0500 en-US text/html
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