Pass H35-462-ENU exam with 100 percent marks with Questions and Answers
We have legitimate and state-of-the-art H35-462-ENU Exam questions that are made up of H35-462-ENU Exam dumps, tested and verified by our certified team. killexams.com gives the most specific and most recent exam practice test which almost involves all test themes. With the database of our H35-462-ENU test prep, you do not have to risk your chance on reading H35-462-ENU textbooks but surely need 24 hrs to get ready for the real H35-462-ENU exam.
Exam Code: H35-462-ENU Practice exam 2022 by Killexams.com team HCS-5G RF Advanced V1.0 HUAWEI Advanced study tips Killexams : HUAWEI Advanced study tips - BingNews
Search resultsKillexams : HUAWEI Advanced study tips - BingNews
https://killexams.com/exam_list/HUAWEIKillexams : Etisalat and Huawei complete Mena's first trial of 6GHz spectrumNo result found, try new keyword!Etisalat by e&, the UAE's biggest telecoms operator, and China's Huawei Technologies said the successful completion of the Middle East and North Africa's first trial of the 6GHz spectrum, which is ...Tue, 02 Aug 2022 23:56:43 -0500en-aetext/htmlhttps://www.msn.com/en-ae/money/news/etisalat-and-huawei-complete-mena-s-first-trial-of-6ghz-spectrum/ar-AA10ghGRKillexams : Research shows wearable ultra-thin sensor is as good as goldJul 04, 2022, 10:24PM ISTSource: ANI
According to a accurate study, a group of researchers have developed a unique, gold-spun, ultra-thin sensor that can be placed directly on the skin without irritation or discomfort. The findings of the study were published in the journal Advanced Optical Materials. The ultrathin sensor can evaluate different biomarkers or substances to perform body chemical analysis. It works using a Raman spectroscopy technique, where laser light aimed at the sensor is changed slightly depending on whatever the chemicals at that point are present on the skin. The sensor can be tuned finely to be extremely sensitive, and it's robust enough for practical use.
Mon, 04 Jul 2022 04:58:00 -0500entext/htmlhttps://timesofindia.indiatimes.com/videos/tech/research-shows-wearable-ultra-thin-sensor-is-as-good-as-gold/videoshow/92661098.cmsKillexams : Public Sector Cybersecurity Summit 2022 – 10 syllabus to Look Out For
If your public organisation is digitally connected then you cannot afford to miss the Public Sector Security Summit 2022 (#PubliSec2022), to be held on 2nd and 3rd August 2022.
Cybercriminals are only becoming more advanced, and more dangerous with attacks costing government organisations worldwide millions if not billions.
This world-class event will allow you to learn from local and international case studies and hear from public sector security experts, enabling you to bolster cyber security within your public organisation, all from the comfort of your home or office.
Attendees who sign up for this exclusive event will be able to hear from these leaders and gain vital information and confidence when taking their next steps in their cybersecurity journeys.
Topics will outline emerging threats against the public sector, global cybersecurity and data protection best practices, and how to mitigate risks.
Here are Just 10 of the syllabus to be Discussed at #PubliSec2022:
You’ve Been Hacked, Now What? Managing and Responding to Cyber Incidents in the Public Sector
Cybersecurity Strategy – Guidance on Cyber Planning for Public Sector Organisations: Where to Get Started
A Government Cyber Security Case Study
Why South Africa Needs a National Cyber Director
Public Sector Cybersecurity: Key Threat Trends
The Right Tools to Help Detect Cyber Risks
Ransomware Threat Detection: A Deep Learning Approach
Addressing the Challenges of Hybrid Working in the Public Sector
Digital Transformation: Is Cyber Threat the Greatest Risk of All?
How to Secure Critical Public Infrastructure
Confirmed Expert Speakers Include:
Godfrey Kyama, Digitalization Consultant, United Nations.
Irene Moetsana-Moeng, Deputy Exec. Director, Public Sector Agency & Chair. Cybersecurity Response Committee, South Africa.
Loice Ngulube, CIO at POSB Zimbabwe.
Craig Nel, MEA Business Development Leader, Digital Assistants & Security at Oracle.
Prof. SH (Basie) von Solms, Director of the Centre for Cybersecurity, University of Johannesburg.
Bruce W. Watson, Full Professor, Centre For Ai Research (Cair), School For Data-Science and Computational Thinking – Stellenbosch University.
Molehe Wesi, CEO: .ZA Domain Authority.
Patrick Devine, Data Security Specialist for Solid8 Technologies.
Preeta Bhagattjee, Director of Tech, Media & Telecoms at CDH.
Abe Wakama, CEO, IT News Africa.
Vitalis Nkwenti, Bespoke Cybersecurity and Assurance Executive and Trainer.
Adv. Lufuno T. Khorommbi, Deputy Chairperson of the Critical Infrastructure Council & Data Privacy and Cybersecurity, Orizur Consulting Enterprise.
Joey Jansen van Vuuren, Manager: Cybersecurity Centre of Innovation Research, Group Leader: Cyber Defence Council for Scientific and Industrial Research.
Sat, 30 Jul 2022 22:13:00 -0500en-UStext/htmlhttps://www.itnewsafrica.com/2022/07/public-sector-cybersecurity-summit-2022-10-topics-to-look-out-for/Killexams : Why We Need Accountability For Effective Cybersecurity Frameworks
Recent security incidents violating IT service providers like SolarWinds and Microsoft have brought to the forefront the importance of accountability and transparency in cybersecurity. The sheer volume of accurate reports of ransomware attacks, cyber intrusions reportedly perpetrated by nation-states, and largescale data breaches affecting millions of people indicates that cyber defenses must be raised across the board—particularly in critical infrastructure, government and essential services.
Any response to these threats must account for the complexity of cybersecurity risk. The shared responsibility model, which delineates ownership of specific risks by different participants in the ecosystem so all bases are covered by those in the best position to do so, provides a useful mechanism for minimizing the frequency and seriousness of security incidents and simplifying the management of the problem.
Public sharing of incident information and prompt sharing of vulnerabilities when appropriate can promote necessary transparency and effective responses. The shared responsibility model includes all of the following elements:
• A clear understanding of who (be it the vendor or the client) is responsible for what.
• What requirements stakeholders and users must follow to meet their responsibilities.
• Adequate visibility and transparency to enable verification that responsibilities are met.
• An objective, independent method to verify conformance.
• Mechanisms that provide accountability and incentivize stakeholders and users to meet their responsibilities.
To ensure the successful implementation of a shared responsibility framework, here are several important recommendations and actions to consider.
Learn From Accountability-Led Cyber Governance Initiatives
In May 2021, President Biden signed the “Executive Order (EO) on Improving the Nation’s Cybersecurity,” which is described as “the most comprehensive change to a national strategy for cybersecurity” that looks to “unify the executive branch on its reporting requirements.” The EO set forth much-needed public-private collaboration to help the U.S.’s National Institute of Standards and Technology (NIST) develop standards and incentives to support cybersecurity risk management.
Specifically, addressing risk in the software and supply chain was critical. A study by BlueVoyant found that 93% of U.S. organizations had experienced a cybersecurity breach in the previous 12 months from vulnerabilities in their vendor ecosystem. Moreover, 33% of respondents said they had no way of knowing if cyber risk emerges in a third-party vendor. Maintaining full visibility into software supply chain security and making security data publicly available, after patches are developed for vulnerabilities, significantly improves the security performance of suppliers and holds everyone accountable.
Germany’s IT Security Act 2.0, for example, heightens the requirement for transparency and accountability through extending the mandate for Germany’s Federal Office for Information Security (BSI). Through the Act, the BSI has the authority to see inventory data from telecom service providers. This extra layer of transparency helps identify the targets or victims of cyberattacks.
Approaches such as the EO and Germany’s Security Act provide guidance that private sector organizations can benefit from to help them develop, strengthen and implement their own approaches to transparency and accountability. The same rules can be applied internally and with their respective vendor ecosystems.
Enhance Security Across The Digital Supply Chain
The surge of digital adoption, exacerbated by the pandemic and rise in remote working, has led to a spike in cyberattacks. The year-on-year volume of ransomware attacks, for instance, increased 158% in North America during 2020, then spiked to 180% by Q2 of 2021.
Both governments and commercial sectors have realized the immense risk in global supply chains and also how little visibility many have into security and assurance levels. Visibility across the supply chain has become critical, particularly between suppliers and operator-customers.
The launch of the U.S. Department of Defense’s (DoD’s) Cybersecurity Maturity Model Certification (CMMC) was a much-anticipated response to major compromises of defense data that had been held on the IT systems of its contractors and company supply chains. The program is intended to safeguard sensitive information while focusing the most advanced cybersecurity standards and third-party assessment requirements on all contractors with the DoD. As of today, the DoD has rolled out CMMC 2.0, and though it is not yet a requirement for contracts, the materials reflect the Department’s strategic intent with respect to the CMMC program.
This is a notable example of one of the U.S. government’s highest-priority programs that there needs to be strict levels of assurance requirements, conformance programs with adequate transparency and substantial consequences for nonconformance. This facilitates meaningful accountability across the entire supply chain.
Promote Global Collaboration Through Mutual Trust Agreements
One way to buttress international cyber norms is to explore the possible use of mutual trust agreements, which could involve separately signed agreements by governments and private companies and the governments of the countries in which the companies do business. Private companies could sign to provide their commitment to follow the articulated rules that they could be held legally liable for if they break them. The host governments of those companies could sign their own agreements with those governments, providing their commitment not to directly or indirectly use those companies for improper purposes and subjecting themselves to the legal process should they do so. Such agreements could outline the standards, norms or rules that companies and host governments will be held liable in the event of nonconformance.
Addressing Cyberthreats Is A Shared Responsibility
Everyone from the C-suite and IT managers to other stakeholders across an organization and its supply chain partners should gain a full understanding of what accountability means for the management of cyber risks and its value for the future of cybersecurity. Mitigating cyber risks calls for rigorous accountability that must apply to the processes and responsibilities of IT security practitioners.
The compliance with, and efficacy of, cybersecurity procedures and practices must be open to scrutiny, and this demands transparency and visibility to make it knowable if requirements are being met—and the failure to conform to the requirements should result in measurable consequences. Transparency and accountability are necessary for successful cyber risk management and governance. Governments and businesses alike can do more to create incentives for conformance that are aligned across the whole ecosystem.
Sun, 10 Jul 2022 12:00:00 -0500Andy Purdyentext/htmlhttps://www.forbes.com/sites/forbestechcouncil/2022/07/11/why-we-need-accountability-for-effective-cybersecurity-frameworks/Killexams : 5G slicing industry to rocket over next six years to be worth US$24bn by 2028
Of all the key end-user benefits expected from 5G networks, the ability to control dedicated portions of spectrum and make customised use of it has always been ranked highly, and enterprises’ willingness to pay for it is set to drive a boom in the global 5G slicing market, says a study from ABI Research.
The report, 5G network slicing: technical and commercial considerations, emphasised that, compared with the uniform services offered over 3G and 4G networks regardless of device or user needs, slicing of 5G has the potential to offer varying levels of connectivity characteristics – such as service-level agreements (SLAs), bandwidth and latency – for different devices, use cases and applications.
ABI said there is an expectation that enterprises will pay a premium for 5G slices that guarantee SLAs for diverse services, as opposed to uniform offerings. It also stressed that enterprises have differentiated requirements for isolation and security that can be satisfied by slicing. The analyst regards this last facet as especially important given that for connected devices, such as dumb internet of things (IoT) terminals, cost and time to market are typically prioritised over security.
As a result, ABI expects 5G slicing revenue to grow from US$309m in 2022 to about U$24bn in 2028, at a compound annual growth rate (CAGR) of 106%.
“5G slicing adoption falls into two main categories,” said Don Alusha, 5G core and edge networks senior analyst at ABI Research. “One, there is no connectivity available. Two, there is connectivity, but there is not sufficient capacity, coverage, performance or security. For the former, both private and public organisations are deploying private network slices on a permanent and ad-hoc basis.”
The second scenario is today mostly catered for by private networks, a market that ABI Research believes will grow from $3.6bn to $109bn by 2023, at a CAGR of 45.8%.
Alusha added: “A sizable part of this market can be converted to 5G slicing. But first, the industry should address challenges associated with technology and commercial models. On the latter, consumers’ and enterprises’ appetite to pay premium connectivity prices for deterministic and tailored connectivity services remains to be determined.
“Furthermore, there are ongoing industry discussions on whether the value that comes from 5G slicing can exceed the cost required to put together the underlying slicing ecosystem.”
In addition to these benefits, the report also suggested that 5G slicing could replace a large part of current private networks and dedicated connectivity services. It can also enrich hyperscaler cloud services with guaranteed connectivity offers while reusing a large part of existing cellular assets. This is said to be why the initial driving force behind 5G slicing uptake is fixed wireless access (FWA) for the enterprise domain.
In making its case for the latter point, ABI observed that there are more than 55 5G slicing proofs of concept and commercial tests from Ericsson, Huawei, Nokia and ZTE. These engagements, said the analyst, deliver the industry the insight to match up an emerging technology such as 5G slicing to new strategic opportunities and high-value use cases, depending on the market.
In a key use case in the Middle East, communications service providers (CSPs) are deploying a separate core network (hardware-based slices) for mission-critical services. In Europe, the tendency has been for CSPs to deploy slices for mission-critical services on top of existing consumer networks. In other words, said ABI, there is a mixed market but with a common denominator in how to unlock growth in the enterprise domain at scale and based on end-to-end standardisation.
“First, it is key for the industry to push for consistency and uniform practices across multiple domains,” said Alusha. “With 5G slicing, the industry should focus on convenience rather than performance, user experience rather than feature sets, and flexibility rather than rigidity. Ultimately, the core of the 5G slicing ‘dream’ is a business goal, not just a technology goal.
“It involves taking a quantum leap forward in how business is conducted within the industry and by the industry’s customers. In contrast to 3G and 4G, with 5G, the industry should focus on value not from technology per se, but rather from the strategic leap forward it can enable. Consequently, a cautious approach is required so that the industry finds in 5G slicing a reasonable basis for taking actions that predictably and positively affect vendors’ and CSPs’ revenues.”
Thu, 04 Aug 2022 01:17:00 -0500entext/htmlhttps://www.computerweekly.com/news/252523499/5G-slicing-industry-to-rocket-over-next-six-years-to-be-worth-US24bn-by-2028Killexams : ACSA launches mobile airport App
This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data.
Mon, 11 Jul 2022 19:41:00 -0500en-UStext/htmlhttps://www.iol.co.za/travel/travel-tips/acsa-launches-mobile-airport-app-930f5f7a-de28-4121-916b-8dd9e14d6573Killexams : Best laptops for engineering students 2022: powerful, portable notebooks
Join our newsletter
All the best features, news, tips and great deals to help you live a better life through technology
Thank you for signing up to T3. You will receive a verification email shortly.
There was a problem. Please refresh the page and try again.
Unlike the best student laptops(opens in new tab), the best laptops for engineering students can't cut corners in order to keep the cost low. Engineering students need serious power and performance from their computing set-up, in order to run essential 3D modelling and video rendering software such as AutoCAD, MATLAB and Solid Works in-between classes and lectures. And that means that a engineer's laptop needs a strong core specs suite.
While our picks of the best laptops for engineering students do contain some great, well-priced systems that we feel most learners could afford to study on at university or college, they are nowhere near as budget friendly as some of our budget recommendations for non-engineering students. This is because we feel many budget systems aimed at students, while fine to bash out an essay in Google Docs, just won't cut it in terms of an engineering student's needs. Each laptop we recommend here has the specs to go the distance and is ideal for back to school season.
Away from raw performance, we've also factored in a few other things we think engineering students need from their laptop. Battery life, for example, is really important, as the last thing anyone needs is their laptop shutting down in the middle of a build. Equally, portability is also important as while power is needed, engineering students need to easily get to and from lectures and seminars and set up shop easily in a library, coffee house or canteen.
How do we know these laptops are perfect for engineering students? Because we've ranked and rated them ourselves, with the systems drawn from our best laptops(opens in new tab), best 2-in-1 laptops(opens in new tab) and best lightweight laptops(opens in new tab) guides. These systems are among the best on the market in 2022, and engineering students heading to college and university should look no further.
The best laptops for engineering students in 2022
The best laptop for engineering students for Windows users
CPU:Intel Core i7-1185G7
Graphics:Intel Iris Xe
RAM:Up to 16GB
Screen:13.4-inch Full HD+ LCD (1920 x 1200)
OS:Windows 10 Home 64-bit
Dimensions:198.70 x 295.70 x 14.80 mm
Reasons to buy
Very strong hardware
Reasons to avoid
Speakers are average
If you're and engineering student and you're a Windows user, too, then the best laptop for you to buy is the Dell XPS 13. Every year the Dell XPS 13 wows us and this year has been no exception, as evidenced in our Dell XPS 13 (9310) review. In the review we discovered the XPS 13 to be everything an engineering student could wish for while taking notes in class or completing coursework in-between seminars – it's powerful, portable, compact and has an impressive battery life, too.
It also comes equipped in its latest incarnation with the very latest 11th-gen Intel processors installed and up to 16GB of RAM installed, too, meaning everything from Netflix to intensive AutoCAD work is easily handled. The Intel Iris Xe GPU doesn't deliver the same sort of performance as a high-end Nvidia graphics card, but it still punches hard and complements the core specs well.
The XPS 13 doesn't let the side down in terms of screen, either, with a 13.4-inch FHD display with the super-thin bezels looking absolutely stunning. If you've got deep pockets you can spec the system out with a 4K screen, too, however we think that to most engineering students the Full HD screen will be plenty. Colors a deep and vibrant and detailing is pin sharp. The whole screen is also coated with Corning Gorilla Glass so it ain't going to crack or scratch easy, either.
The best laptop for engineering students for Mac users
Screen:13.3-inch 2,560 x 1,600 pixel-resolution Retina display
Connectivity:2 x Thunderbolt 4 / USB-C
Camera:720p FaceTime camera
Weight:1.29 kg (2.8 pounds)
Dimensions:11.97 x 8.36 x 0.63 inches (30.41 x 21.24 x 1.61cm; W x D x H)
Reasons to buy
Excellent build quality
Sturdy, luxe design
Giant battery life
Reasons to avoid
More ports would be nice
Webcam still not great
As evidenced in our MacBook Air (M1, 2020) review, the latest MacBook Air is an absolute marvel of a machine, and perfectly suited to engineering students as a result.
The real star of the show is the M1 processor, which is just so ludicrously powerful and optimised that it is crushes rival CPUs in benchmarks with ease. It also packs in some seriously impressive graphics processing power, too, so right off the back you've got a system here perfectly equipped to heavy modelling, editing and rendering work.
You can spec the MacBook Air at purchase with 16GB of RAM, too, meaning you're covered in that department, and naturally for a MacBook you've also got a very tidy battery life, with this model stretching up to 15 hours in real world use (although expect a little less with hardcore AutoCAD work.
Comfort and usability is top-notch too – the keyboard and trackpad are excellent, it's a great size and weight to be portable, and the all-aluminium build is solid and feels premium. The sharp screen is also a pleasure to use, with a good level of brightness.
Basically, it ticks all our boxes for a great laptop for engineering students, and also comes with that premium Apple aesthetic, too.
Some of you may be thinking that you need even more power that this and, yes, we understand. The MacBook Pro is a thing and, if you can afford it, it is a quality system. However, from our testing the MacBook Air is the better buy. If you need more info you can check out T3's Macbook Air M1 vs Macbook Pro M1 comparison feature, though, to help you decide.
For our money, though, this is the best laptop for engineering students running macOS on the market today.
3. Dell XPS 17
The best premium laptop for engineering students
Starting weight:2.11 kg (4.65 lb)
Dimensions:19.5 x 374.45 x 248.05 mm
Screen:17.0" UHD+ (3840 x 2400) InfinityEdge Touch
CPU :10th Generation Intel Core i9-10885H
GPU:Nvidia GeForce RTX 2060 6GB
Storage:2TB M.2 PCIe NVMe SSD
Reasons to buy
Large, top-tier screen
Super powerful hardware spec
Superb Dell fit and finish
The Dell XPS 13 above is a brilliant system for engineering students, but if you like the Dell aesthetic but feel you need a larger, more powerful system that takes the word premium to a whole new level, then you're going to want to check out the beastly Dell XPS 17.
At top spec the XPS 17 delivers what is among the best screen on any laptop, ever, in the form of a 17-inch UHD+ (3840 x 2400 resolution) InfinityEdge Touch panel, which also comes with an Anti-Reflective coating. The screen, in partnership with tiny bezels, means real estate is bountiful and thanks to the Ultra HD resolution, everything on it is absolutely pin sharp. It is truly a stunning display and trust us when we say this, it will be ideal for engineering software usage.
The XPS 17 continues it dominance with a top hardware spec that will make any tech enthusiast drool. We're talking a monstrous 64GB of RAM in conjunction with an insanely rapid Intel Core i9 which makes even 8K video editing and any sort of engineering rendering work an absolute doddle.
Need to spend time on your course working in Photoshop? Well, you can edit huge TIF files side-by-side without the Dell XPS 17 breaking sweat. And an Nvidia GeForce RTX2060 6GB ensures that modern AAA games are crushed while also providing loads of support grunt for rendering and processing, too.
Throw in the rest of the typical Dell package, which includes a fantastic fit and finish, excellent connectivity options, a built-in webcam and microphone, a stereo woofer and multiple speakers and a full fat copy of Windows 10 Home 64-bit, and it becomes easy to see how this laptop will serve its engineering student for years to come.
The best premium Mac laptop for engineering students
CPU:Apple M1 Pro or Apple M1 Max
Graphics:Apple M1 Pro or Apple M1 Max
RAM:Up to 64GB
Screen:14.2-inch (3024 x 1964 pixels) or 16-inch (3456 x 2234 pixels)
Storage:Up to 8GB
Connectivity:SDXC card slot, HDMI port, 3.5 mm headphone jack, three Thunderbolt 4 (USB-C) ports
Camera:1080p FaceTime camera
Reasons to buy
Reasons to avoid
We're not sure about the display notch
To use these new M1-powered 14-inch and 16-inch MacBook Pros from Apple is to love them: the entry price is on the high side, but you can't fail to be impressed by the amount of performance you get here – it really is a significant step up from the Intel-powered MacBook Pros that came before. At the same time, these machines offer some serious battery life too.
This being Apple, the build quality and design is of course very good too. Apple has finally seen sense and done away with the Touch Bar on the keyboard, and whether you're typing or using the trackpad, it's a quality experience. We're pleased that the webcam has been upgraded to 1080p as well, though we're not quite sure about that display notch at the top of the screen...
Even when you're putting some heavy demands on the 14-inch and 16-inch MacBook Pro models, they still stay impressively quiet and cool, and for a lot of users these are a no-brainer in terms of the best laptops around – perhaps the most difficult part of the decision is whether to go for the 14-inch or the 16-inch model.
5. Dell Vostro 5515
The best budget student laptop
CPU:AMD Ryzen 7 5700U
GPU:AMD Radeon Graphics integrated
Storage:512GB SSD M.2
Screen:15.6-inch FHD (1920 x 1080)
Battery:4-Cell Battery, 54WHr (Integrated)
OS:Windows 10 Pro 64-bit
Reasons to buy
Huge discount right now
Strong all-round system
Reasons to avoid
GPU isn't very powerful
As we said above in our introduction, we feel engineering students absolutely should spend a bit more on their laptop than most students as they absolutely need strong core performance from their system. Simply put, they can't compromise on that.
That's why right now we're recommending the Dell Vostro 5515 over at the official Dell store as our best budget engineering student pickup. It's massively discounted right now, and that means a system loaded with an AMD Ryzen 7 5770U processor with integrated Radeon graphics, 16GB of RAM and a 512GB M.2 PCIe NVMe SSD.
The Vostro 5515 also comes with a 15.6-inch FHD 1920 x 1080 screen, 4-Cell 54WHr battery, and full fat copy of Windows 10 Pro 64-bit.
The integrated graphics card here is the weak point, as it is not top tier, but everything else about this system is strong and fast. If you can get this system discounted then its absolutely worth it if you're shopping on a budget.
The best lightweight laptop for engineering students
CPU:Intel Core i7-1165G7 (2.8 GHz, Turbo up to 4.7 GHz, L3 Cache 12MB, 28W)
Graphics:Intel Iris Xe Graphics
RAM:16GB LPDDR4X 4266MHz
Screen:17-inch IPS WQXGA 2560 X 1600
Dimensions:H x W x D = 26.01 x 38.02 x 1.78 cm (14.97 x 10.24 x 0.7 inches)
Reasons to buy
Fantastic 17-inch screen
Lightweight, stylish design
Plenty of battery life
Reasons to avoid
Not a touchscreen
As you can discover in T3's full LG Gram 17 review (2021), the reason why you choose this laptop to go to college and study engineering is, first and foremost, because despite it coming with a 17-inch screen it weighs only 1,350 grams (that's just under 3 lbs). It also measures in at a super thin (26.01 x 38.02 x 1.78 cm), make it incredibly portable.
It's a portable superstar, but that doesn't mean its hardware spec lets it down, with an Intel Core i7-1165G7 processor, Intel Iris XE graphics chip, 16GB of RAM and a 256GB SSD on board. The battery life is also impressive, and is definitely good for all-day study sessions and MATLAB work.
We think the LG Gram 17 is great and, if that wasn't enough proof that this is system to scope out, then also consider that it recently won the hyper prestigious Best Laptop award at the T3 Awards 2021.
Rounding up our list of the very best laptops for engineering students is the beautiful HP Spectre x360 (2021), which delivers premium 2-in-1 functionality.
It delivers this thanks to a superb core spec that includes 11th generation Intel Core processors, buckets of RAM, loads of storage space and strong graphics performance in the form of Intel Iris Xe.
The fit and finish of this hybrid is also right up there, rivalling Apple's M1 MacBook Pro in our mind. The keyboard is superb, too, and the screen is bright and clear. As the screen is a touchscreen panel, naturally it also unlocks illustrating, marking up and designing with a digital stylus.
The HP Spectre x360 (2021) is also capable of 13 hours from a single charge, meaning it delivers genuine all-day usage performance.
A stylish, powerful and lightweight laptop engineering students will love
CPU:11th Gen Intel Core i7
Graphics:Intel Iris Xe Graphics
Display:FHD 13.3-inch touchscreen
Reasons to buy
Small, thin and lightweight
Reasons to avoid
Average battery life
Webcam could be better
No SD card slot
As we note in T3's full HP Elite Dragonfly G2 review, this is a laptop that packs oodles of power into a very stylish and compact form factor.
Thanks to a combination of powerful Intel 11th gen i7 processor, plenty of RAM and an Intel Iris Xe graphics card, you've got plenty of processing power on tap, while a crisp touchscreen display makes tweaking models by hand easy.
The battery life on this system isn't stellar and we're guessing most engineering students would appreciate an SD card slot for loading and unloading big files, but aside from these points its a great Windows 11 system.
Perfect for taking nots in lecturers and working on the go with ease on campus, but then loaded with plenty of guts to get involved in serious number crunching and CAD design work back in the dorm.
How to buy the best laptop for engineering students for your needs
The first thing you should ask yourself when looking for a laptop for engineering students is just how much power you think you'll need. Different courses and programs have varying software requirements, such as AutoCAD, MATLAB and Solid Works, for example, and depending on the types of projects you're going to be working on, you're likely going to need a fair bit of rendering and processing power.
That comes from the core hardware suite of the laptop, so we're talking CPU, RAM and SSD storage, but also ideally from a dedicated GPU. Buying a laptop with a dedicated GPU can have massive benefits as a lot of rending and processing can be outsourced to them in many engineering software programs, speeding up rendering and production times by orders of magnitude. After all, the last thing a student wants is to wait for hours on end in-between classes with their professor just because their system is underpowered.
Here at T3 we think the base level spec an engineering student should consider is an Intel Core i5 processor (or AMD equivalent), along with 16GB of RAM and a 512GB SSD. This should ideally then be combined with a dedicated GPU from Intel, AMD or Nvidia. If we were to recommend a spec for an engineering student laptop, though, then we'd likely bump the processor up to an Intel Core i7. Obviously, the more RAM you can afford the better (32GB or 64GB is ideal).
In terms of graphics card, Intel GPUs should be considered the entry level, and ideally a system with a 20 or 30-series Nvidia RTX card would be on the cards. Indeed, that's why engineering students who are also passionate gamers should consider one of the best gaming laptops as a system, too, as they often come loaded with advanced graphics cards like these. They are, though, admittedly not quite as portable.
Thu, 05 Aug 2021 01:19:00 -0500Robert Jonesentext/htmlhttps://www.t3.com/us/news/best-laptops-for-engineering-studentsKillexams : The resilience myth: fatal flaws in the push to secure chip supply chains
In the sweltering Asia summertime of mid-June, Taiwan Semiconductor Manufacturing Co urgently dispatched a team to Japan to visit some of the company’s equipment suppliers. Why, it wanted to know, were these companies saying they could not deliver vital machines on time? TSMC is the world’s largest chip manufacturer, and its suppliers had always bent over backward to provide what the powerful company was demanding but, for the first time, it was being met with apologetic messages.
The situation was highly sensitive. TSMC is in the midst of a $100bn expansion, spurred on by governments in the wake of last year’s alarming shortages of crucial chips. But the Taiwanese giant has found its own supply chains to be plagued by bottlenecks, affecting items that range from lenses so precise they could focus a laser beam on a pingpong ball on the moon, to apparently mundane valves and tubes.
The June mission followed on the heels of a similar trip by the company’s supply chain management chief, JK Lin, and a task force to the US in March, to investigate why the chipmaking machines TSMC ordered there were taking up to 18 months to turn up.
In Japan, suppliers including Tokyo Electron, the country’s largest chipmaking equipment manufacturer, and Screen Semiconductor Solutions told TSMC they might miss even the elongated delivery times they have promised, sources familiar with the tricky meetings told Nikkei Asia.
Screen — one of the few companies in the world making the chemical cleaning machines that are vital in chipmaking plants — reeled off a list of obscure components that it was having trouble securing from its own supply chain. Valves, tubes, pumps and containers made of special plastics — all are in short supply.
The problems are cascading from provider to provider and making it hard to resolve the global shortage of chips, the hearts and brains that power electronic devices from PCs and smartphones to automobiles.
The difficulties underscore a series of inconvenient truths, not just for TSMC and its rivals and suppliers, but for policymakers around the world. Amid US-China trade tensions and pandemic disruptions, governments in China, the US, Europe and elsewhere have determined to “onshore” semiconductor manufacturing. So-called supply chain resilience has become a central aim of policy. But such resilience is a myth.
These new national efforts are backed by huge subsidies and state-backed investments. The US Senate at the end of July approved the $52bn CHIPS Act. Japan’s government will back TSMC to the tune of ¥476bn ($3.5bn) to build a factory there for the first time.
The trouble is these efforts touch only the visible end of the semiconductor supply chain. Behind chip production sits a network supplying equipment and other items encompassing hundreds of raw materials, chemicals, consumable parts, gases and metals without which the bogglingly precise process of chipmaking could not function. China is directing a combined Rmb1.5tn ($221bn) of public and private investments to replicate a chip supply chain within its own borders, with modest results to date.
While a globalised semiconductor industry used to run smoothly across dozens of countries, the effort to replicate this architecture inside single countries or regions has revealed and exacerbated bottlenecks in the supply chain, according to Nikkei Asia’s investigations and interviews with more than two dozen senior industry executives from the major chip economies of the US, EU, Taiwan and Japan over the past five months. At the same time, there are questions over the long-term wisdom of the policy, and fears about whether, if they can be gotten up and running, many of these factories might ultimately sit idle.
JT Hsu, head of semiconductors and materials at Boston Consulting Group, said even a goal of reaching 70 to 80 per cent self-reliance is “extremely tough . . . It could be extremely challenging for any country or region to get all the fronts covered.”
This article is from Nikkei Asia, a global publication with a uniquely Asian perspective on politics, the economy, business and international affairs. Our own correspondents and outside commentators from around the world share their views on Asia, while our Asia300 section provides in-depth coverage of 300 of the biggest and fastest-growing listed companies from 11 economies outside Japan.
“It’s not only the [factories] that manufacture the chips but it’s everything that goes in there,” said Jens Liebermann, vice-president of semiconductor materials at the electronic materials business unit of BASF, the German chemical group. “All the materials, chemicals, gases and their raw materials. All have to be there. It comes down to, where is the source, where is the raw material, where is the manufacturing, and who can handle the logistics?”
Morris Chang, an elder statesman of the semiconductor industry who founded and formerly chaired TSMC, put it most bluntly in remarks addressed to the US.
“If you want to re-establish a complete semiconductor supply chain in the US, you will not find it as a possible task,” he said at an industry forum last year. “Even after you spend hundreds of billions of dollars, you will still find the supply chain to be incomplete, and you will find that it will be very high cost, much higher cost than what you currently have.”
Despite how insignificant they might sound, those valves, tubes, pipes, pumps and containers are a case study in complexity — and they are driving executives mad.
“I am not kidding! We are still receiving valves and tubes that we ordered more than a year ago,” one executive with a Taiwanese provider to TSMC told Nikkei. “When opening the box, we are often very shocked. The box might contain only 10 pieces out of a 100-piece order.”
With only a handful of specialist suppliers able to meet anti-contamination standards and deal with the red tape of manufacturing items that also have potential military use, it has been no easy task to increase capacity, especially with limited supplies of the raw materials behind them.
These items are made of special plastics called fluoropolymers and are indispensable to the handling of corrosive chemicals and ultrapurified water that flows in all chip manufacturing facilities and chipmaking machines, where standards keep going up and up.
The most advanced chips, those used to build the latest iPhone and MacBook processors, for example, are now at the 5-nm level. Nanometre size refers to the line width between transistors on a chip. A nanometre is roughly 1/100,000 of the thickness of a piece of paper or human hair. The smaller the nanometre size, the more cutting-edge and powerful the chips are, and thus more challenging to develop and produce. In turn, chipmakers need to place billions of transistors on a chip. The tolerance for a defect or microcontamination is extremely low.
“The size of a Covid virus is about 100 nm,” Kevin Gorman, senior vice-president of integrated supply chain transformation with Merck Electronics of Germany, told Nikkei. “You can then see how refined the chip manufacturing work is and why all the materials are critical.”
When it comes to semiconductor-grade valves and tubes for handling chemicals, it is crucial they do not become a source of contamination. Only a few suppliers worldwide have the capability to reach the exacting requirements, according to Nikkei Asia analysis. CKD and Advance Electric of Japan and Entegris of the US, are qualified suppliers of valves; Iwaki of Japan is the dominant provider for chemical-handling pumps; industry sources referred to Agru of Austria and Georg Fischer of Switzerland as essential providers of the critical piping systems for chip plants.
The Wassenaar Arrangement, a multinational agreement signed by more than 40 nations to avoid such components being shipped to rogue states for military use, adds red tape that provides another barrier to new entrants.
Follow the supply chain upstream, and further chokepoints emerge with regard to the fluoropolymers from which these components are made. One such material, known as PFA, is only supplied by Chemours of the US and Daikin Industries of Japan. It requires extensive knowhow to process, and no competitors are on the horizon.
Other key fluoropolymer material makers include Solvay of Belgium, 3M of the US, Gujarat Fluorochemicals of India and HaloPolymer of Russia. But not all of them are qualified to build semiconductor-grade materials and they must supply to a wide range of other industries beyond the tech sector. Sources from Russia have dropped away due to the disruption and sanctions caused by its war in Ukraine.
Hsu Chun-yuan, chief business development officer of United Integrated Services, a leading cleanroom builder for TSMC and rival chipmaker Micron Technology, told Nikkei that “sources of fluoropolymers are constrained” and there have been “demand hikes from both the chip and battery industries, driven by the electric vehicle boom”.
And further upstream still? Fluoropolymers are processed from fluorspar, also known as fluorite, a mineral of which China controls nearly 60 per cent of the global production output, according to data from market research company IndexBox. China has long identified fluorspar as a strategic resource and back in the late 1990s limited exports due to its importance to industries from agriculture, electronics and pharmaceuticals to aviation, space and defence. The mineral is often labelled as a “semi-rare earth”.
According to IndexBox, Mexico is the second-largest producer of fluorspar with about 10.8 per cent of the market last year, followed by Mongolia and South Africa. In Europe, Bulgaria and Spain together control some 5 per cent of the global market. In a supply chain review paper published by the White House in 2021, the US flagged the risks of critical materials subject to foreign domination and identified fluorspar as one in a list of “shortfall strategic and critical materials”. The report did not point out its deep link with the chipmaking industry. It said increasing sources of critical minerals, strengthening stockpiles, and ramping up North American manufacturing, processing, and recycling capacity could result in fewer disruptions during “future worldwide crises”.
Similar issues arise in the handling of gases such as neon, used in lithography, and C4F6, a fluorine gas used in etching. Both count either Ukraine or Russia as a major source of supply, which has been disrupted by the war. The equipment for moving them around is also highly specialised.
Only a handful of companies — including Rotarex of Luxembourg and BBB Neriki Valve and Hamai Industries of Japan — are qualified to supply the ultra high purity valves for the gas cylinders that the semiconductor industry uses, Nikkei Asia supply chain checks show. Rotarex controls close to 80 per cent of the market and only produces these specific items in Luxembourg.
The valves, built with stainless steel and other alloys, must endure extensive verification processes and need to be government certified because of the dangers of leaks and explosions. It would take “10 to 20 years” for a new entrant to meet the standards and tests of different government authorities for certification, some industry executives told Nikkei.
Trade tension, pandemic and war
The call for chip supply chain resilience emerged amid the US-China tech war when former US president Donald Trump’s administration clamped down on Chinese tech champion Huawei Technologies in 2019 and blocked its use of American technologies, especially chips, citing national security. The drastic move spurred an aggressive nationwide Chinese campaign across sectors to cut dependence on the US and build a secure, self-controllable supply chain.
The self-sufficiency movement evolved into a global campaign in late 2020, as unprecedented chip shortages stalled car production and hurt a wide range of industries, crimping global economic growth and threatening jobs. The US Department of Commerce said the shortages wiped an estimated $240bn off the country’s gross domestic product in 2021. The automobile industry alone made 7.7mn fewer cars than the year before.
The Ukraine war has further amplified demands for supply chain security. The war drove up prices of energy, metals, chemicals and crucial gases that many chip-related suppliers needed. It also increased the sense of urgency.
For most major economies, chips are essential for building everything from computers and data centres to appliances and cars. They are central to the battle for supremacy in space, science, artificial intelligence and EVs, and will be crucial to the military and defence equipment of the future. Advanced chips are integral to an array of critical national security capabilities “including sophisticated weapons systems such as the Javelin antitank missiles the US is supplying to Ukraine to defend itself against Putin’s invasion”, the US Department of Commerce pointed out in a accurate report.
Governments so far have promised to pour more than $100bn into subsidising the building of local chip supply chains. As well as the US CHIPS Act, the EU adopted the €45bn ($46bn) European Chips Act, Japan had budgeted ¥600bn and India set up a $30bn funding programme for semiconductors and other tech sectors.
Major chipmakers from Intel, Micron and Texas Instruments in the US to TSMC and South Korea’s Samsung Electronics have separately announced more than $650bn in investments. These include several outside their home bases. TSMC is building in the US and Japan, Intel plans to expand in Europe and south-east Asia, and Samsung has construction plans in the US. According to SEMI’s estimate, some 91 new chip plants are set to go online worldwide from 2020 through 2024.
When the European Chips Act was enacted earlier this year, European Commission president Ursula von der Leyen acknowledged that “no country — and even no continent — can be entirely self-sufficient”. The hope is that parts of the supply chain that cannot be brought onshore will at least run through friendly nations.
“Europe will always work to keep global markets open and to keep them connected. This is in the world’s interest; it is in our own interest, too,” she said. “Europe will build partnerships on chips with like-minded partners, for example the United States or for example Japan. It is about balanced interdependencies and it is about reliability.”
US Treasury secretary Janet Yellen has floated “friendshoring” as a compromise concept. “We cannot allow countries to use their market position in key raw materials, technologies, or products to have the power to disrupt our economy or exercise unwanted geopolitical leverage,” she said in April. “Let’s build on and deepen economic integration and the efficiencies it brings, on terms that work better for American workers. And let’s do it with the countries we know we can count on.”
Russia’s fall from western favour demonstrates that alliances can shift over time and spats can emerge even between nations ostensibly committed to free trade.
Japan limited the export of photoresists, a crucial chipmaking chemical dominated by Japanese suppliers, to South Korea during a Tokyo-Seoul trade war in 2019.
An assessment by BCG suggests there are at least 50 chokepoints in the semiconductor supply chain across design tools, manufacturing, packaging, materials and equipment. These points are defined as areas where 65 per cent or more of a particular item is concentrated in a single country or region.
The US dominates chip design tools and at least 23 types of essential equipment, it found. Japan is a leader in the production and critical formulation of critical materials that include wafers as well as photoresists. Europe is the leader in industrial gas.
The extreme ultraviolet (EUV) lithography machine exclusively built by ASML of the Netherlands provides a prime example of how difficult it is to switch a component in the chip supply chain. Sometimes it is just impossible to find alternatives.
The EUV machine is indispensable in the production of cutting-edge chips of 7 nm and below, helping project the complicated patterns of integrated circuits on a microscale. Production delays are hampering the ability to add new capacity, lengthening the current chip crunch and setting back the introduction of more cutting-edge chips.
ASML has extended the waiting time for several models to two years due to constraints on vital parts including optical mirrors and lenses, people familiar with the matter told Nikkei. A company spokesperson acknowledged some delays and said constraints on the industry were “very diverse and across multiple tier suppliers”.
Creating EUV light inside a vacuum chamber within a machine is exceptionally challenging, relying on Germany’s Trumpf for a powerful laser source and another German partner, the optics specialist Zeiss Group, for a system of mirrors to reflect and direct the light.
Since even the smallest irregularities cause aberrations, Zeiss boasts that its product is the world’s “most precise” mirror. “If one of these EUV mirrors were to redirect a laser beam and aim it at the moon, it would be able to hit a pingpong ball on the moon’s surface,” CEO Andreas Pecher told Nikkei. Zeiss and ASML have been working together for nearly 30 years.
Even if ASML wants to strengthen its own supply chain resilience and looks for other optical partners, it will require at least five to 10 years of co-development work before getting initial results, several executives told Nikkei.
“Actually it’s almost not replaceable in the many years to come,” Nikkei heard from one executive at a Japanese lens maker.
There is almost no part of the chipmaking process that does not require deep specialisation and no part of the supply chain that can be simply and quickly duplicated.
Chemicals and solvents used in chip plants need to reach the so-called part-per-trillion (PPT) grade — one particle to 1tn drops. Gases need to reach a purity of up to 99.9999 per cent — the so-called 6N — when it comes to cutting-edge chip production. For silicon wafers, the basic substrate materials that chips are fabricated on, all need to be as pure as 9N, or 99.9999999 per cent, an executive with the chip material distributor Wah Lee Industrial told Nikkei.
“If you want a resilient chip supply chain, you not only need chip plants, you also need a whole string of suppliers from critical chemicals and precision components all coming along,” said an executive at Japan’s Daikin. “Building a semiconductor plant takes several years, but building chemical plants will take even longer given the extensive environmental assessments and regulations for handling chemicals.”
The long road to onshoring
China’s efforts demonstrate that the practical difficulty of building a chip supply chain cannot be overcome by throwing billions of dollars into the effort. As early as 2014, Beijing launched the first phase of the China Integrated Circuit Industry Investment Fund, nicknamed the Big Fund, with Rmb138.7bn. Another Rmb204bn followed in 2019. The first national seed fund stimulated more than Rmb500bn of investment from the private sector and local governments; the second phase of the fund is expected to encourage a further Rmb1tn.
China indeed increased local chip production — to 16.7 per cent of its domestic needs in 2021 from 12.7 per cent a decade before, IC Insights data show.
The mathematical implication of having many countries creating new onshore chip supply chains is that capacity is going to be much greater than the world as a whole actually needs.
The industry has indicated that these are often noneconomic investment plans by saying that, in many cases, factories will only be built if they are heavily subsidised. With consumer spending on electronics apparently slowing sharply and recession talk in the air, the outlook for real chip demand, at least in the short term, is suddenly uncertain.
Gorman of Merck Electronics acknowledged questions about whether local plants could reach economic scale, but said it still makes sense to localise if its key customers could together shoulder the risks.
“Keeping the supply line short is also better for our environment,” he told Nikkei. “Our customers . . . will favour a local supply over one that has to cross international borders.”
Building an onshore chip supply chain is a “very large-scale and long-term journey”, BASF’s Liebermann told Nikkei. “It will take a lot of time and a lot of costs and the cost will only be justified if the utilisation rates of those new plants are meeting the demand, and the demand is high enough.”
Most industry executives believe a long-term increase in chip demand is locked in, regardless of the current economic environment, as everyday items become more connected and complex and as cars go electric and, ultimately, autonomous. A semiconductor industry that had revenues of nearly $600bn in 2021 is widely projected to be at $1tn by 2030.
“If we really believe that the industry will be reaching $1tn . . . we should be able to have some level of regionalisation of the manufacturing and have the right leverage,” Bertrand Loy, CEO of Entegris, told Nikkei. “But we won’t be able to have manufacturing everywhere and get the right leverage. We are investing in some countries, some products, but not in all countries for all products because we cannot afford [to do] that.”
ASML believes regional investments “can coexist, if connected to a global ecosystem”, its spokesperson said. “Compartmentalisation leads to sub-optimisation, which leads to higher cost and slower innovation for consumers and companies and governments who rely on this innovation.”
‘No longer an era of free trade’
Simon HH Wu, president of San Fu Chemical, a Taiwanese chipmaking chemical supplier, reckons geopolitical conflicts and trade barriers are prevailing over globalisation, upon which the chip industry was built. “It’s no longer an era of free trade,” he told Nikkei, warning that policymakers and the industry should be under no illusions about the difficulties ahead.
“Any country that controls certain natural resources or key technologies would want to protect and leverage those resources for economic and political benefits,” Wu said. “What companies could do is to look for allies and partners to alleviate the potential disruptions.
“There’s always something you need to import and ship from another place, country or even continent. If you don’t have phosphate rock how do you produce chipmaking phosphoric acid? If you don’t have fluorspar, how do you produce fluoropolymers? At the end of the day, you can’t move all those mines and natural resources . . . next door.”
JT Hsu, the head of semiconductors and materials at BCG, said the chip crunch shows it is about time to build some “redundant” capacity to deliver the industry a buffer to absorb shocks. “However,” he said, “it’s nearly impossible and unrealistic that any country or region could reach a point of 100 per cent self-reliance, in terms of making everything about chips from the start to the end. That’s not possible now and that is not likely to be possible in the future.”
Thu, 04 Aug 2022 21:25:00 -0500en-GBtext/htmlhttps://www.ft.com/content/f76534bf-b501-4cbf-9a46-80be9feb670cKillexams : 50 of the best Prime Day deals in the UK for day two – as picked by our experts
Amazon Prime Day is now in its second and final day. There are literally thousands of Prime Day deals up for grabs right now - so many, in fact, that you may run out of time before you've even had the chance to browse the lion share of sales.
That's where we come in. We've put together this handy all-killer-no-filler abbreviated list of the best Prime Day deals for those in a rush. Every one of these choices comes from our main coverage and ongoing live blog - and they're essentially our favourite promotions so far.
Many of these Prime Day deals are on products we've personally reviewed, so we're confident in reviewing them. Personal highlights so far? Probably, as expected, the wide range of lowest-ever prices on Amazon's own-brand devices, which are quite simply cheap as chips right now. If you're looking to kick-start your smart home setup, then it's a great time to be bargain hunting.
Alex is deals editor at Future PLC and an all-around expert at one thing - saving readers as much cash as possible while scoring them the best products for their needs. With content that's always packed full of helpful information, no-nonsense expertise, and of course deals, Alex has also written for other leading sites such as T3 and GamesRadar. At work, you'll find him mostly covering computing, gaming, and advising people on how to save on their cell phone plans. Outside of work, you'll find him playing guitar, indulging his love for music, or down at the local climbing gym mostly hanging off boulders far too difficult for his abilities.
Mon, 11 Jul 2022 16:21:00 -0500Alex Whitelockentext/htmlhttps://www.techradar.com/deals/50-best-prime-day-deals-for-day-twoKillexams : Get Shellbot SL60 LiDar Robot Vacuum and Mop cleaner for $314 (Retail Price $370)No result found, try new keyword!Shellbot SL60 LiDar Robot Vacuum and Mop is a smart AI-enabled vacuum and mop robot that comes with the advanced LDS Navigation ... specific areas like your study or kid’s play area.Mon, 18 Jul 2022 23:33:00 -0500en-UStext/htmlhttps://www.gizmochina.com/2022/07/19/get-shellbot-sl60-lidar-robot-vacuum-and-mop-cleaner-for-314-retail-price-370/H35-462-ENU exam dump and training guide direct download Training Exams List