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Killexams : IBM Development benefits - BingNews https://killexams.com/pass4sure/exam-detail/000-183 Search results Killexams : IBM Development benefits - BingNews https://killexams.com/pass4sure/exam-detail/000-183 https://killexams.com/exam_list/IBM Killexams : IBM Expands Its Power10 Portfolio For Mission Critical Applications

It is sometimes difficult to understand the true value of IBM's Power-based CPUs and associated server platforms. And the company has written a lot about it over the past few years. Even for IT professionals that deploy and manage servers. As an industry, we have become accustomed to using x86 as a baseline for comparison. If an x86 CPU has 64 cores, that becomes what we used to measure relative value in other CPUs.

But this is a flawed way of measuring CPUs and a broken system for measuring server platforms. An x86 core is different than an Arm core which is different than a Power core. While Arm has achieved parity with x86 for some cloud-native workloads, the Power architecture is different. Multi-threading, encryption, AI enablement – many functions are designed into Power that don’t impact performance like other architectures.

I write all this as a set-up for IBM's announced expanded support for its Power10 architecture. In the following paragraphs, I will provide the details of IBM's announcement and deliver some thoughts on what this could mean for enterprise IT.

What was announced

Before discussing what was announced, it is a good idea to do a quick overview of Power10.

IBM introduced the Power10 CPU architecture at the Hot Chips conference in August 2020. Moor Insights & Strategy chief analyst Patrick Moorhead wrote about it here. Power10 is developed on the opensource Power ISA. Power10 comes in two variants – 15x SMT8 cores and 30x SMT4 cores. For those familiar with x86, SMT8 (8 threads/core seems extreme, as does SMT4. But this is where the Power ISA is fundamentally different from x86. Power is a highly performant ISA, and the Power10 cores are designed for the most demanding workloads.

One last note on Power10. SMT8 is optimized for higher throughput and lower computation. SMT4 attacks the compute-intensive space with lower throughput.

IBM introduced the Power E1080 in September of 2021. Moor Insights & Strategy chief analyst Patrick Moorhead wrote about it here. The E1080 is a system designed for mission and business-critical workloads and has been strongly adopted by IBM's loyal Power customer base.

Because of this success, IBM has expanded the breadth of the Power10 portfolio and how customers consume these resources.

The big reveal in IBM’s latest announcement is the availability of four new servers built on the Power10 architecture. These servers are designed to address customers' full range of workload needs in the enterprise datacenter.

The Power S1014 is the traditional enterprise workhorse that runs the modern business. For x86 IT folks, think of the S1014 equivalent to the two-socket workhorses that run virtualized infrastructure. One of the things that IBM points out about the S1014 is that this server was designed with lower technical requirements. This statement leads me to believe that the company is perhaps softening the barrier for the S1014 in data centers that are not traditional IBM shops. Or maybe for environments that use Power for higher-end workloads but non-Power for traditional infrastructure needs.

The Power S1022 is IBM's scale-out server. Organizations embracing cloud-native, containerized environments will find the S1022 an ideal match. Again, for the x86 crowd – think of the traditional scale-out servers that are perhaps an AMD single socket or Intel dual-socket – the S1022 would be IBM's equivalent.

Finally, the S1024 targets the data analytics space. With lots of high-performing cores and a big memory footprint – this server plays in the area where IBM has done so well.

In addition, to these platforms, IBM also introduced the Power E1050. The E1050 seems designed for big data and workloads with significant memory throughput requirements.

The E1050 is where I believe the difference in the Power architecture becomes obvious. The E1050 is where midrange starts to bump into high performance, and IBM claims 8-socket performance in this four-socket socket configuration. IBM says it can deliver performance for those running big data environments, larger data warehouses, and high-performance workloads. Maybe, more importantly, the company claims to provide considerable cost savings for workloads that generally require a significant financial investment.

One benchmark that IBM showed was the two-tier SAP Standard app benchmark. In this test, the E1050 beat an x86, 8-socket server handily, showing a 2.6x per-core performance advantage. We at Moor Insights & Strategy didn’t run the benchmark or certify it, but the company has been conservative in its disclosures, and I have no reason to dispute it.

But the performance and cost savings are not just associated with these higher-end workloads with narrow applicability. In another comparison, IBM showed the Power S1022 performs 3.6x better than its x86 equivalent for running a containerized environment in Red Hat OpenShift. When all was added up, the S1022 was shown to lower TCO by 53%.

What makes Power-based servers perform so well in SAP and OpenShift?

The value of Power is derived both from the CPU architecture and the value IBM puts into the system and server design. The company is not afraid to design and deploy enhancements it believes will deliver better performance, higher security, and greater reliability for its customers. In the case of Power10, I believe there are a few design factors that have contributed to the performance and price//performance advantages the company claims, including

  • Use Differential DIMM technology to increase memory bandwidth, allowing for better performance from memory-intensive workloads such as in-memory database environments.
  • Built-in AI inferencing engines that increase performance by up to 5x.
  • Transparent memory encryption performs this function with no performance tax (note: AMD has had this technology for years, and Intel introduced about a year ago).

These seemingly minor differences can add up to deliver significant performance benefits for workloads running in the datacenter. But some of this comes down to a very powerful (pardon the redundancy) core design. While x86 dominates the datacenter in unit share, IBM has maintained a loyal customer base because the Power CPUs are workhorses, and Power servers are performant, secure, and reliable for mission critical applications.

Consumption-based offerings

Like other server vendors, IBM sees the writing on the wall and has opened up its offerings to be consumed in a way that is most beneficial to its customers. Traditional acquisition model? Check. Pay as you go with hardware in your datacenter? Also, check. Cloud-based offerings? One more check.

While there is nothing revolutionary about what IBM is doing with how customers consume its technology, it is important to note that IBM is the only server vendor that also runs a global cloud service (IBM Cloud). This should enable the company to pass on savings to its customers while providing greater security and manageability.

Closing thoughts

I like what IBM is doing to maintain and potentially grow its market presence. The new Power10 lineup is designed to meet customers' entire range of performance and cost requirements without sacrificing any of the differentiated design and development that the company puts into its mission critical platforms.

Will this announcement move x86 IT organizations to transition to IBM? Unlikely. Nor do I believe this is IBM's goal. However, I can see how businesses concerned with performance, security, and TCO of their mission and business-critical workloads can find a strong argument for Power. And this can be the beginning of a more substantial Power presence in the datacenter.

Note: This analysis contains insights from Moor Insights & Strategy Founder and Chief Analyst, Patrick Moorhead.

Moor Insights & Strategy, like all research and tech industry analyst firms, provides or has provided paid services to technology companies. These services include research, analysis, advising, consulting, benchmarking, acquisition matchmaking, and speaking sponsorships. The company has had or currently has paid business relationships with 8×8, Accenture, A10 Networks, Advanced Micro Devices, Amazon, Amazon Web Services, Ambient Scientific, Anuta Networks, Applied Brain Research, Applied Micro, Apstra, Arm, Aruba Networks (now HPE), Atom Computing, AT&T, Aura, Automation Anywhere, AWS, A-10 Strategies, Bitfusion, Blaize, Box, Broadcom, C3.AI, Calix, Campfire, Cisco Systems, Clear Software, Cloudera, Clumio, Cognitive Systems, CompuCom, Cradlepoint, CyberArk, Dell, Dell EMC, Dell Technologies, Diablo Technologies, Dialogue Group, Digital Optics, Dreamium Labs, D-Wave, Echelon, Ericsson, Extreme Networks, Five9, Flex, Foundries.io, Foxconn, Frame (now VMware), Fujitsu, Gen Z Consortium, Glue Networks, GlobalFoundries, Revolve (now Google), Google Cloud, Graphcore, Groq, Hiregenics, Hotwire Global, HP Inc., Hewlett Packard Enterprise, Honeywell, Huawei Technologies, IBM, Infinidat, Infosys, Inseego, IonQ, IonVR, Inseego, Infosys, Infiot, Intel, Interdigital, Jabil Circuit, Keysight, Konica Minolta, Lattice Semiconductor, Lenovo, Linux Foundation, Lightbits Labs, LogicMonitor, Luminar, MapBox, Marvell Technology, Mavenir, Marseille Inc, Mayfair Equity, Meraki (Cisco), Merck KGaA, Mesophere, Micron Technology, Microsoft, MiTEL, Mojo Networks, MongoDB, MulteFire Alliance, National Instruments, Neat, NetApp, Nightwatch, NOKIA (Alcatel-Lucent), Nortek, Novumind, NVIDIA, Nutanix, Nuvia (now Qualcomm), onsemi, ONUG, OpenStack Foundation, Oracle, Palo Alto Networks, Panasas, Peraso, Pexip, Pixelworks, Plume Design, PlusAI, Poly (formerly Plantronics), Portworx, Pure Storage, Qualcomm, Quantinuum, Rackspace, Rambus, Rayvolt E-Bikes, Red Hat, Renesas, Residio, Samsung Electronics, Samsung Semi, SAP, SAS, Scale Computing, Schneider Electric, SiFive, Silver Peak (now Aruba-HPE), SkyWorks, SONY Optical Storage, Splunk, Springpath (now Cisco), Spirent, Splunk, Sprint (now T-Mobile), Stratus Technologies, Symantec, Synaptics, Syniverse, Synopsys, Tanium, Telesign,TE Connectivity, TensTorrent, Tobii Technology, Teradata,T-Mobile, Treasure Data, Twitter, Unity Technologies, UiPath, Verizon Communications, VAST Data, Ventana Micro Systems, Vidyo, VMware, Wave Computing, Wellsmith, Xilinx, Zayo, Zebra, Zededa, Zendesk, Zoho, Zoom, and Zscaler. Moor Insights & Strategy founder, CEO, and Chief Analyst Patrick Moorhead is an investor in dMY Technology Group Inc. VI, Dreamium Labs, Groq, Luminar Technologies, MemryX, and Movandi.

Wed, 13 Jul 2022 12:00:00 -0500 Matt Kimball en text/html https://www.forbes.com/sites/moorinsights/2022/07/14/ibm-expands-its-power10-portfolio-for-mission-critical-applications/
Killexams : Old building claimed for new life as home for tech companies

The Carnegie Avenue entrance of the six-story building at 10900 Carnegie in Cleveland will remain closed as the structure's new owners see its Cedar Avenue entry as more aligned with the structure's future than the past.

That is because the IBM Explorys building, the Cleveland Clinic's Global Cardiovascular Innovation Center and other ventures are nearby on Cedar. So many cutting-edge ventures are close that the Fairfax Renaissance Development Corp. calls the area its "New Economy Neighborhood" as part of the community development corporation's plans to capitalize on the East Side's new Opportunity Corridor.

Agriplex Genomics, which works at the DNA level to Strengthen productivity and health benefits in plants and animals, has committed to lease two floors in the building that will be renovated primarily for medical research space. About one-third of the space will continue to be used as offices.

An Agriplex spokesman who declined to be identified said in an email that the company needs room to grow to 15,000 square feet from about 7,000 square feet. It's now housed at the Clinic's Innovation Center.

Agriplex plans to use 10900 Carnegie as its research and development center and global headquarters, thanks to Northeast Ohio's talent pool, to provide reagents and software to support its ongoing expansion through the United States and to Europe, Brazil, Canada and China.

The building's remake follows its purchase by CedarTech LLC for $1.37 million from the Cleveland Clinic, which had called it the "DD Building."

The new owners are Brian Smith, the developer of the Tru by Hilton Cleveland Midtown and North Park Place townhouses on nearby Stokes Boulevard; Dick Pace, president of Cumberland Development of Cleveland; and a silent investor, a self-described biotech entrepreneur based in Las Vegas.

Smith said in an interview that the building's tired exterior belies its intrinsic value, thanks to 30 years of ownership by the Clinic.

The prior owner converted the one-time warren of medical offices and suites to open offices, which makes it easier to revamp areas of the building as labs for researchers. Moreover, its mechanical systems and wiring are top-drawer, and most needed improvements are cosmetic.

Smith should know. He is the retired director of construction at the Clinic who is now making investments in the neighborhood surrounding his former employer.

Lakewood's Dimit Architects is working up a plan to update the building's Carnegie side, even though the new owners will continue to use the Cedar entrance and address for the venture, Smith said. The Carnegie side of the building retains some of the 1956-vintage building's stone at street level, but the 1970s upper floors were given a once-trendy metal-and-glass facade that is outdated.

"Inside, it has offices with desks and staplers, and the Cedar side has lots of parking, although the lot needs to be repaved, which we plan to do," Smith said.

The venture also has the benefit of direct knowledge of the biotech market. Pace owns the Baker Electric Building, 7100 Euclid Ave. The building is a hive of biotech businesses now following a pioneering project in the multitenant medical research realty market in Cleveland.

"With the exception of two small suites on the second floor, the Baker building is practically full," Pace said in a phone interview. "Another home for health startups makes a lot of sense. We've been approached by other companies we can't accommodate and need a place for our tenants who might need to expand."

Pace said he has been excited by all the innovation and biotech efforts sweeping the area from Midtown to University Circle in latest years.

Though Agriplex is its first tenant, it may not be alone long after moving in later this month.

"Things are going really well." Smith said. "We may soon have the building half full."

Thu, 04 Aug 2022 06:28:00 -0500 en text/html https://www.crainscleveland.com/real-estate/old-building-claimed-new-life-home-tech-companies
Killexams : IBM Announces Novel Advancement in 3D Wafer Stacking
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At this point we’re all familiar with the global chip shortage. It’s affected every single industry in the world, it seems. Now IBM has come up with a new way to manufacture silicon wafers that it says could ease the strain a bit. It partnered with Tokyo Electron (TEL) on creating a new method for stacking silicon wafers vertically. Although IBM’s most advanced research node is currently 2nm, it doesn’t state which process it’s using for this technique. It only mentions it’s using it to stack 300mm (12-inch) wafers.

IBM’s announcement claims it’s the first of its kind for a wafer of this size. The goal is to advance Moore’s Law by making wafer stacking a simpler process. This will allow IBM to add more transistors to a given volume via stacking. It notes that traditionally 3D stacking has only been used in “high end operations” such as with High-Bandwidth Memory (HBM). AMD has notably also done it recently with the L3 cache on its Ryzen 7 5800X3D CPU. It also was the first GPU company to employe HBM on a GPU with its Fiji and Fury families, back in 2015.

(Image: IBM)

IBM’s new process is essentially a novel way to join silicon wafers together. Traditional chip-stacking requires through-silicon vias (TSVs) between the layers. This allows electricity to flow upwards into the stack, and for both layers to work in tandem. This requires the backside of the layer to be thinned to reveal the TSVs for the other layer to connect to them. The layers in a stack are very thin, measuring less than 100 microns. Due to their fragility, they require a carrier wafer to support them.

Typically these carrier wafers are made of glass. The carrier wafer is bonded to the wafer to make sure it can go through production without being damaged. Once it’s finished production, the carrier is removed with a UV laser. In some cases a silicon carrier can be used too, but separating it from the layer requires a mechanical force. This can be dangerous for the integrity of the wafer it’s supposed to be protecting. This is where IBM’s new invention comes into play, as it’s figured out a way to debond two silicon wafers that’s transparent to silicon. It has achieved this by using an infrared laser to decouple the wafers.

This will allow two silicon wafers to be stacked without the use of glass carriers. Instead manufactures can just skip that step and go straight to silicon-to-silicon. IBM says in addition to simplifying the process by no longer requiring this extra step, there are other advantages as well. As an example it says it will help in eliminating tool compatibility and chucking issues, introduce fewer defects, and allow for inline testing of thinned wafers. These benefits will enable “advanced chiplet production” according to IBM. It also says its technology can scale very well.

IBM and TEL have been working on this technology since 2018, so it’s been in the hopper for a little while. This could be a crucial development for the industry given where things are headed in silicon fabrication. As node sizes shrink down to sub-2nm, packaging and stacking technologies will become a crucial advantage for companies looking to increase performance when “moving to a smaller node” is no longer an option.

Intel is already looking to begin advanced 3D stacking with Meteor Lake, using its Foveros technology. AMD is way ahead of the game on that front, as mentioned previously. However, so far it’s only stacking L3 cache on its CPUs with Zen 3. However, there are rumors it will repeat that with Zen 4 as well with so-called Raphael-X products. It remains unclear if stacking will also be employed in its upcoming RDNA3 GPUs.

IBM says it’s built a beta tooling facility in Albany, NY to work on its new technology. In the future it will be expanding its work. Its goal is to eventually create a full 3D chip stack using this technology. The company says this advancement will help with supply chain issues, while also allowing for performance benefits too. “We hope our work will help cut down on the number of products needed in the semiconductor supply chain, while also helping drive processing power improvements for years to come,” it stated.

Now Read:

Tue, 12 Jul 2022 06:53:00 -0500 Josh Norem en-US text/html https://www.extremetech.com/extreme/337853-ibm-announces-novel-advancement-in-3d-wafer-stacking
Killexams : AI development service Market Size, Share, growth, Trends and Forecast 2022-2030

The MarketWatch News Department was not involved in the creation of this content.

Aug 05, 2022 (Alliance News via COMTEX) -- The global AI development service market size was US$ 31.1 billion in 2021. The global AI development service market is forecast to grow to US$ 705.1 billion by 2030, registering a compound annual growth rate (CAGR) of 36.5 during the forecast period from 2022 to 2030.

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Factors Influencing the Market

The trending use of multi-cloud functioning is driving the growth of the industry. In addition, the rising demand for cloud-based intelligence services will propel the market growth during the forecast period. IBM estimates that around 98% of the organization’s plan will adopt multi-cloud architectures by 2021.

Companies are focusing on integrating artificial intelligence (AI) technology into their applications, businesses, analytics, and services in order to expand the business and make the task easy for employees. Thus, it will benefit the AI development service market. Furthermore, AI development services will also help businesses cut operating costs in order to enhance profit margins. All of this will contribute to the growth of the global AI development service market.

Many government bodies, particularly in emerging economies, are investing highly due to the benefits of AI. In India, the Digital India initiative is expected to offer ample growth opportunities for the market. In addition, the firms are creating services for testing AI-based applications. In April 2019, Google Cloud Platform launched the AI Platform, a new end-to-end environment for teams to test, train, and deploy models. As a result, it will offer ample growth opportunities for the global AI development service market.

Impact of COVID-19 on AI Development Service Market

The sudden onset of COVID-19 has surged the growth of AI development services in the healthcare sector. AI development services are used to Strengthen treatment and enhance accuracy and efficiency. AI can predict patient outcomes using a significant quantity of data available in electronic healthcare records. All of these factors are significantly contributing to the growth of the global AI development service industry.

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Regional Analysis

The Asia-Pacific AI development service market is forecast to hold dominance during the study period. The growth of the region is attributed to the rising number of investments in artificial intelligence. In addition, the presence of top tech giants in the region is forecast to benefit the Asia-Pacific AI development service market. Furthermore, emerging countries, such as India and Taiwan, are witnessing an increasing adoption of new AI-based services or models. As a result, it will further expand the potential scope of the studied market.

Competitors in the Market

  • International Business Machine Corporation
  • Google
  • Salesforce
  • SAP SE
  • Amazon Web Service, Inc.
  • Fair Isaac Corporation
  • Advanced Micro Devices
  • Ayasdi AI LLC
  • IBM Watson Health
  • Zebra Medical Vision, Inc.
  • Intel Corporation
  • Enlitic, Inc.
  • Baidu, Inc.
  • Cyrcadia Health
  • Atomwise, Inc.
  • Other prominent players

Market Segmentation

The global AI development service market segmentation focuses on Deployment, Organization, End-User, and Region.

Deployment

Organization Size

  • Small and Medium Enterprise
  • Large Enterprise

End-user Industry

  • BFSI
  • Retail
  • Healthcare
  • IT and Telecom
  • Manufacturing
  • Energy
  • Other End-user Industries

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Based on region

  • North America
  • The U.S.
  • Canada
  • Mexico
  • Europe
  • Western Europe
  • The UK
  • Germany
  • France
  • Italy
  • Spain
  • Rest of Western Europe
  • Eastern Europe
  • Poland
  • Russia
  • Rest of Eastern Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia & New Zealand
  • ASEAN
  • Rest of Asia Pacific
  • Middle East & Africa (MEA)
  • UAE
  • Saudi Arabia
  • South Africa
  • Rest of MEA
  • South America
  • Brazil
  • Argentina
  • Rest of South America

What is the goal of the report?

1.The market report presents the estimated size of the market at the end of the forecast period. The report also examines historical and current market sizes.
2.During the forecast period, the report analyzes the growth rate, market size, and market valuation.
The report presents current trends in the industry and the future potential of the North America, Asia Pacific, Europe, Latin America, and the Middle East and Africa markets.
3.The report offers a comprehensive view of the market based on geographic scope, market segmentation, and key player financial performance.

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COMTEX_411674060/2796/2022-08-05T10:06:21

The MarketWatch News Department was not involved in the creation of this content.

Fri, 05 Aug 2022 02:06:00 -0500 en-US text/html https://www.marketwatch.com/press-release/ai-development-service-market-size-share-growth-trends-and-forecast-2022-2030-2022-08-05
Killexams : Systems Ltd and IBM cohost Transcend 2022 Killexams : Systems Ltd and IBM cohost Transcend 2022 - Daily Times Wed, 29 Jun 2022 12:00:00 -0500 en-US text/html https://dailytimes.com.pk/960001/systems-ltd-and-ibm-cohost-transcend-2022/ Killexams : Cloud Computing in Banking Market to See Huge Growth by 2027: Google, IBM, Aliyun

This press release was orginally distributed by SBWire

New Jersey, USA — (SBWIRE) — 07/21/2022 — A Latest intelligence report published by AMA Research with title "Cloud Computing in Banking Market Outlook to 2027.A detailed study accumulated to offer Latest insights about acute features of the Global Cloud Computing in Banking market. This report provides a detailed overview of key factors in the Cloud Computing in Banking Market and factors such as driver, restraint, past and current trends, regulatory scenarios and technology development. A thorough analysis of these factors including economic slowdown, local & global reforms and COVID-19 Impact has been conducted to determine future growth prospects in the global market.

Definition:
Cloud computing is the delivery of computing service such as servers, storage, databases, networking, software, analytics, and the Internet. Companies offering these computing services are called cloud providers. The cloud computing has offered number of benefits to various industries such as banking. It makes things easier like interoperability, secure storage, 24A—7 up time, and others. Also, it creates an opportunity for bankers to connect with their users directly. Moreover, it is an easy technique to deploy and integrate with all the services of the bank system.

Major Players in This Report Include,

Amazon Web Services (United States),Google (United States),Microsoft Azure (United States),IBM (United States),Aliyun (United States),Salesforce (United States),Oracle (United States),SAP (Germany),Workday (United States),Adobe (United States),Cisco Systems (United States),EMC Corporation (United States)

Free demo Report + All Related Graphs & Charts @: https://www.advancemarketanalytics.com/sample-report/137053-global-cloud-computing-in-banking-market

Market Trends:
– Rising Adoption of Hybrid Cloud Services

Market Drivers:
– Benefits Such as Cost Effective, Feasibility, Reliability, and Productivity
– Increased Return on Investments with Low Infrastructure and Storage Costs

Market Opportunities:
– Growing Adoption by Large, Medium and Small Enterprises
– Digital Transformation among the Industries

The Global Cloud Computing in Banking Market segments and Market Data Break Down are illuminated below:
by Deployment (Public cloud, Private cloud), Type of cloud computing (Infrastructure as a Service (IaaS), Platform as a Service (PaaS), Software as a service (SaaS)), Organisation size (SMEs, Large enterprises), Workload (Application development and testing, Data storage and backup, Resource management, Orchestration services, Others)

Cloud Computing in Bankingthe manufacturing cost structure analysis of the market is based on the core chain structure, engineering process, raw materials and suppliers. The manufacturing plant has been developed for market needs and new technology development. In addition, Cloud Computing in Banking Market attractiveness according to country, end-user, and other measures is also provided, permitting the reader to gauge the most useful or commercial areas for investments. The study also provides special chapter designed (qualitative) to highlights issues faced by industry players in their production cycle and supply chain. However overall estimates and sizing, various tables and graphs presented in the study gives and impression how big is the impact of COVID.

Enquire for customization in Report @: https://www.advancemarketanalytics.com/enquiry-before-buy/137053-global-cloud-computing-in-banking-market

Geographically World Cloud Computing in Banking markets can be classified as North America, Europe, Asia Pacific (APAC), Middle East and Africa and Latin America. North America has gained a leading position in the global market and is expected to remain in place for years to come. The growing demand for Cloud Computing in Banking markets will drive growth in the North American market over the next few years.

In the last section of the report, the companies responsible for increasing the sales in the Cloud Computing in Banking Market have been presented. These companies have been analyzed in terms of their manufacturing base, basic information, and competitors. In addition, the application and product type introduced by each of these companies also form a key part of this section of the report. The latest enhancements that took place in the global market and their influence on the future growth of the market have also been presented through this study.

Report Highlights:
– Comprehensive overview of parent market& substitute market
– Changing market dynamics in the industry (COVID & Economic Impact Analysis)
– In-depth market segmentation (Trends, Growth with Historical & Forecast Analysis)
– latest industry trends and development activity
– Competitive landscape (Heat Map Analysis for Emerging Players & Market Share Analysis for Major Players along with detailed Profiles)

Strategic Points Covered in Table of Content of Cloud Computing in Banking Market:
Chapter 1: Introduction, market driving force product Objective of Study and Research Scope the Global Cloud Computing in Banking market
Chapter 2: Exclusive Summary – the basic information of the Global Cloud Computing in Banking Market.
Chapter 3:Changing Impact on Market Dynamics- Drivers, Trends and Challenges & Opportunities of the Global Cloud Computing in Banking; Post COVID Analysis
Chapter 4: Presenting the Global Cloud Computing in Banking Market Factor Analysis, Post COVID Impact Analysis, Porters Five Forces, Supply/Value Chain, PESTEL analysis, Market Entropy, Patent/Trademark Analysis.
Chapter 5: Displaying the by Type, End User and Region/Country 2016-2021
Chapter 6: Evaluating the leading manufacturers of the Global Cloud Computing in Banking market which consists of its Competitive Landscape, Peer Group Analysis, BCG Matrix & Company Profile
Chapter 7: To evaluate the market by segments, by countries and by Manufacturers/Company with revenue share and sales by key countries in these various regions (2021-2027)
…………….

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Key questions answered
– Who are the Leading key players and what are their Key Business plans in the Cloud Computing in Banking market?
– What are the key concerns of the five forces analysis of the Cloud Computing in Banking market?
– What are different prospects and threats faced by the dealers in the Cloud Computing in Banking market?
– What possible measures players are taking to overcome and stabilize the situation?

Thanks for studying this article; you can also get individual chapter wise section or region wise report version like North America, Middle East, Africa, Europe or LATAM, Asia.

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New Jersey USA – 08837
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[email protected]

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Thu, 21 Jul 2022 09:03:00 -0500 ReleaseWire en-US text/html https://www.digitaljournal.com/pr/cloud-computing-in-banking-market-to-see-huge-growth-by-2027-google-ibm-aliyun
Killexams : 3D IC Market Emerging Players May Yields New Opportunities 2028 | Top Players: IBM, ASE Technology Holding Co., Ltd., STMicroelectronics, SAMSUNG

The MarketWatch News Department was not involved in the creation of this content.

Aug 02, 2022 (Heraldkeepers) -- Companies desiring an efficient business growth should adopt market research report like Global 3D IC Market which seems to be very imperative in this rapidly changing marketplace. While formulating this market report, absolute industry insight, talent solutions, practical solutions and use of technology are merged together very well to advance user experience. The business report brings to notice many points regarding 3D IC industry and market. These are mainly explained with respect to market definition, market segmentation, competitive analysis, and research methodology as major subjects of the consistent 3D IC report. It also gives details about market drivers and market restraints which aids businesses in guessing about reducing or increasing the production of specific product.

A thorough market study and investigation of trends in consumer and supply chain dynamics covered in the wide-reaching 3D IC market report helps businesses draw the strategies about sales, marketing, and promotion. Besides, market research performed in this industry report puts a light on the challenges, market structures, opportunities, driving forces, and competitive landscape for the business. It assists in obtaining an extreme sense of evolving industry movements before competitors. If businesses are willing to gain competitive advantage in this swiftly transforming marketplace, then opting for such market research report is highly suggested as it gives a lot of benefits for a thriving business.

Get Exclusive demo of This Premium Report @ https://www.databridgemarketresearch.com/request-a-sample/?dbmr=global-3d-ic-market

Data Bridge Market Research analyses that the 3D IC market will exhibit a CAGR of 33% for the forecast period of 2021-2028. Rise demand for connected devices, rising application of internet of things by the various end user verticals and rising adoption of high- end servers major factors attributable to the growth of 3D IC market. This signifies that the 3D IC market value will rise up to USD 29.65 billion by the year 2028.

3D IC stands for three-dimensional integrated circuit. It consists of three dimensional arrays of interconnected devices. It is a metal-oxide-semiconductor integrated circuit which is composed of silicon wafers or dies. It helps to Strengthen the operational efficiency at reduced power and a smaller footprint.

Rising demand for advanced electronic products with superior functionality has resulted in propelling growth in the 3D IC market value. Rising demand for 3Dpackaging solutions is another important factor fostering the growth of the 3D IC market. Upsurge in the research and development proficiencies has further generated lucrative growth opportunities for the 3D IC market. Rising penetration of smart portable devices is another factor fostering the growth of the market.

Our research and insights help our clients in identifying compatible business partners.

The assessment provides a 360� view and insights, outlining the key outcomes of the industry, current scenario witnesses a slowdown and study aims to unique strategies followed by key players. These insights also help the business decision-makers to formulate better business plans and make informed decisions for improved profitability. In addition, the study helps venture or private players in understanding the companies more precisely to make better informed decisions

Global 3D IC Market: Competitive Analysis

This report has enlisted the top suppliers and their cost structures, SLA terms, best selection criteria, and negotiation strategies. The competitive analysis helps the vendor to define an alignment or fit between their capabilities and opportunities for future growth prospects.

The report deeply explores the latest significant developments by the leading vendors and innovation profiles in the Global 3D IC Market including

IBM, ASE Technology Holding Co., Ltd., STMicroelectronics, SAMSUNG, Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation., Micron Technology, Inc., MonolithIC 3D Inc. , Intel Corporation, TEZZARON., Amkor Technology, JCET Group Co., Ltd., United Microelectronics Corporation., Xilinx, ANSYS, Inc, Cadence Design Systems, Inc., EV Group (EVG), SUSS MICROTEC SE, Siliconware Precision Industries Co., Ltd. and Camtek among other domestic and global players..

This report also comprises of strategic profiling of key players in the market, systematic analysis of their core competencies, and draws a competitive landscape for the market. This research study lends a hand to the purchaser in comprehending the various drivers and restraints with their effects on the market during the forecast period. The report has been prepared based on the market type, size of the organization, availability on-premises and the end-users' organization type. 3D IC report puts across the idea of high level analysis of major market segments and identification of opportunities.

Read Detailed Index of Full Research Study @ https://www.databridgemarketresearch.com/reports/global-3d-ic-market

Global 3D IC Market Scope and Market Size

The 3D IC market is segmented on the basis of component, application, substrate, technology and end- user industry. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.

  • On the basis of component, the 3D IC market is segmented into LED, memories, MEMS, sensor, logic and others.
  • On the basis of application, the 3D IC market is segmented into logic, imaging and optoelectronics, memory, MEMS/sensors, LED, power, analog and mixed signal, RF, photonics and others.
  • On the basis of substrate, the 3D IC market is segmented into silicon on insulator and bulk silicon.
  • On the basis of technology, the 3D IC market is segmented into 3D wafer-level chip-scale packaging (WLCSP), 3D TSV, silicon epitaxial growth, beam Re-crystallization, solid phase crystallization and wafer bonding.
  • On the basis of end- user industry, the 3D IC market is segmented into consumer electronics, telecommunication, industrial sector, automotive, military and aerospace, smart technologies and medical devices.

An exceptional 3D IC market research report can be structured well with the blend of top attributes such as highest level of spirit, practical solutions, committed research and analysis, innovation, talent solutions, integrated approaches, most up-to-date technology and dedication. Further, strategic planning supports in improving and enhancing the products with respect to customer's preferences and inclinations. The report comprises of all the market shares and approaches of the major competitors or the key players in this industry. Moreover, this market report also brings into the focus various strategies that have been used by other key players of the market or this industry.

Major Regions:

Geographically, this report split into several key regions, with sales (MT), Revenue (Million USD), market share, and growth rate for these regions, covering

**North America (United States, Canada and Mexico)

**Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

**Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

**South America (Brazil, Argentina, Colombia, and Rest of South America)

**Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

What Are The Market Factors Explained in the Report?

Key Strategic Developments: The study includes the major strategic developments of the market, comprising R&D, new product launch, M&A, agreements, partnerships, collaborations, joint ventures, and regional growth of the key competitors functioning in the market on a global and regional scale.

Key Market Features: The report analyzed key market features, comprising price, revenue, capacity, supply/demand, capacity utilization rate, gross, production, production rate, market share, consumption, import/export, cost, CAGR, and gross margin. Besides, the report also offers a comprehensive study of the key market dynamics and their latest trends, along with relevant market segments and sub-segments.

Analytical Tools: The Global 3D IC Market report includes the accurately studied and analyzed data of the key industry players and their scope in the market by means of several analytical tools. The analytical tools such as Porter's five forces analysis, feasibility study, and ROI analysis have been used to analyze the growth of the key players functioning in the market.

Some Major Points in TOC:

Chapter 1. Report Overview

Chapter 2. Global Growth Trends

Chapter 3. Market Share by Key Players

Chapter 4. Breakdown Data by Type and Application

Chapter 5. Market by End Users/Application

Chapter 6. COVID-19 Outbreak: 3D IC Industry Impact

Chapter 7. Opportunity Analysis in Covid-19 Crisis

Chapter 8. Market Driving Force

And Many More...

Check The Complete Table of Content @ https://www.databridgemarketresearch.com/toc/?dbmr=global-3d-ic-market

3D IC Market: Key Highlights

  • CAGR of the market during the forecast period.
  • Detailed information on factors that will assist market growth.
  • Estimation of market size and its contribution to the parent market
  • Predictions on upcoming trends and changes in consumer behaviour
  • Analysis of the market's competitive landscape and detailed information on vendors
  • Comprehensive details of factors that will challenge the growth of market vendors

Reasons for Buying this Report

**This 3D IC report provides pin-point analysis for changing competitive dynamics

**It provides a forward looking perspective on different factors driving or restraining 3D IC market growth

**It provides a six-year forecast assessed on the basis of how the 3D IC market is predicted to grow

**It helps in understanding the key product segments and their future

**It provides pin point analysis of changing competition dynamics and keeps you ahead of competitors

**It helps in making informed business decisions by having complete insights of 3D IC market and by making in-depth analysis of market segments

Thanks for studying this article you can also get individual chapter wise section or region wise report version like North America, Europe, MEA or Asia Pacific.

Looking for provoking fruitful enterprise relationships with you!

About Data Bridge Market Research, Private Ltd

Data Bridge Market Research Pvt Ltd is a multinational management consulting firm with offices in India and Canada. As an innovative and neoteric market analysis and advisory company with unmatched durability level and advanced approaches. We are committed to uncover the best consumer prospects and to foster useful knowledge for your company to succeed in the market.

Data Bridge Market Research is a result of sheer wisdom and practice that was conceived and built-in Pune in the year 2015. The company came into existence from the healthcare department with far fewer employees intending to cover the whole market while providing the best class analysis. Later, the company widened its departments, as well as expands their reach by opening a new office in Gurugram location in the year 2018, where a team of highly qualified personnel joins hands for the growth of the company. "Even in the tough times of COVID-19 where the Virus slowed down everything around the world, the dedicated Team of Data Bridge Market Research worked round the clock to provide quality and support to our client base, which also tells about the excellence in our sleeve."

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Tue, 02 Aug 2022 05:16:00 -0500 en-US text/html https://www.marketwatch.com/press-release/3d-ic-market-emerging-players-may-yields-new-opportunities-2028-top-players-ibm-ase-technology-holding-co-ltd-stmicroelectronics-samsung-2022-08-02
Killexams : DRaaS Market Growing at a CAGR 21.6% | Key Player Microsoft, IBM, VMware, AWS, Sungard AS
DRaaS Market Growing at a CAGR 21.6% | Key Player Microsoft, IBM, VMware, AWS, Sungard AS

“Microsoft (US), IBM (US), VMware (US), AWS (US), Sungard AS (US), iland (US), Recovery Point (US), InterVision (US), TierPoint (US), and Infrascale (US).”

DRaaS Market by Service Type (Backup & Restore, Real-Time Replication, Data Protection, and Professional Services), Deployment Mode (Public Cloud and Private Cloud), Organization Size, Vertical and Region – Global Forecast to 2027

The global DRaaS Market size is estimated to be USD 8.8 billion in 2022 and is projected to reach USD 23.5 billion by 2027, at a CAGR of 21.6% during the forecast period. Compelling need to lower TCO, save time, and allow IT teams to shift focus to higher-value tasks is one of the key factors driving market growth.

Download PDF Brochure: https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=962

By Service Type, the backup & restore segment to hold the largest market size during the forecast period

The backup & restore segment is estimated to account for the largest market share among service types. Backup is the process of copying data in cloud computing environments, while restore refers to the restoration of deleted or damaged files from storage media in the event of disasters. Backup & restore services offer various benefits to enterprises, including increased agility, data retention, lower costs, faster deployments, and improved data protection.

By Organization Size, the SMEs segment to grow at a higher CAGR during the forecast period

The Small & Medium Sized Enterprises (SMEs) segment is expected to have a higher CAGR growth during the forecast period. Organizations with less than 1,000 employees are categorized as SMEs. SMEs generally face critical challenges in the form of capital, skills, and scalability. To overcome these issues, SMEs adopt the pay-as-you-go model to ensure they are not tied to contracts that have tedious provisions. The pay-as-you-go payment model also provides SMEs a great deal of service scalability.

Request demo Pages: https://www.marketsandmarkets.com/requestsampleNew.asp?id=962

The key market players that dominate the DRaaS market include Microsoft (US), IBM (US), VMware (US), AWS (US), Sungard AS (US), iland (US), Recovery Point (US), InterVision (US), TierPoint (US), and Infrascale (US). These players have adopted various strategies such as new product launches and enhancements, partnerships, collaborations, and acquisitions to grow in the DRaaS market.

Microsoft is a global multinational technology corporation that produces computer software, consumer electronics, personal computers, and related services. It offers a large product portfolio, including operating systems, cross-device productivity applications, server applications, business solution applications, desktop and server management tools, software development tools, and video games. Microsoft is one of the leading players in the DRaaS market. The company’s DRaaS offerings comprise backup and recovery solutions and disaster recovery services. Microsoft offers DRaaS solutions and services through Microsoft Azure. In May 2020, Microsoft launched Back2Business Solution Boxes to enable SMBs in India maintain business continuity during COVID-19 and continue cloud adoption.

IBM is a leading provider of cloud platform services and cognitive solutions. The company offers infrastructure, hosting, and consulting services in different areas that consist of customer relationship management, business analytics optimization, outsourcing, software, and security. The organization provides efficient and reliable disaster recovery and business continuity services to large enterprises and SMBs in the DRaaS market. IBM’s Resiliency DRaaS offers clients several benefits, including enhanced RTO and RPO, tailored solution architectures for different requirements of different businesses, and reduced recovery costs via automation and orchestration capabilities. In November 2021, IBM acquired SXiQ, which enhanced IBM Consulting’s capabilities in Australia and New Zealand to modernize applications and technology infrastructure in the cloud.

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Killexams : Long story short: Clear the way for women in the workplace

Women have been disproportionately saddled with the impact COVID has had on their families and careers. 

Nearly 5.4 million women have lost or left their jobs since February 2020, according to data from the National Women’s Law Center. Creating more inclusive work cultures, offering family-friendly benefits, and providing support in the form of mentorship and sponsorship can help women stay on track and make up for pandemic-era losses. 

In this week’s top stories, workplace insights platform Comparably recently released its list of top-ranked CEOs, chosen by their female employees. Leaders from Hubspot, IBM, Adobe and others all made the list. For women, it’s not just who they work for, but where: lending firm Clarify Capital ranked the best and worst states for women-owned businesses, based on factors like the percentage of women-owned businesses, the gender pay gap and female unemployment rate in those states. 

Read more: Nominations for EBN’s Excellence in Benefits Awards are now open

Expecting women to make it on their own won’t help close the wage gap or get women back to work. Three leadership experts share why sponsorship is a key component to getting more women into leadership roles. While a mentor helps women with their personal and professional goals, a sponsor takes responsibility for promoting an employee to a higher level position.  

“Coaching is about development. Mentoring is about guidance. Sponsorship is about pulling someone up and advocating for them,” says Rubina F. Malik, a learning and development adviser at Malik Global Solutions. “More CEOs and higher-ups need to be allies for women. Put them in the spotlight and get them opportunities to be seen.” 

Fri, 15 Jul 2022 03:11:00 -0500 en text/html https://www.benefitnews.com/list/helping-women-succeed-at-work
Killexams : Synopsys and IBM Announce Availability of Fully Synthesizable PowerPC Cores and SystemC Models

Synopsys to Deliver Complete System to Implementation Solution for Power Architecture Designs

MOUNTAIN VIEW, Calif. and BARCELONA, Spain, June 8 -- Synopsys, Inc. (Nasdaq: SNPS), a world leader in semiconductor design software, and IBM today announced the availability of fully synthesizable versions of IBM's PowerPC(R) 405 and 440 processors as part of the DesignWare(R) Star IP (intellectual property) program. The IBM PowerPC processors will be distributed as fully soft register transfer level (RTL) cores which can be easily implemented in any foundry process and configured to product design requirements including low power, high performance, or small silicon area. SystemC(TM) models of the PowerPC cores and associated peripherals will be distributed in Synopsys' System Studio architecture design and analysis environment. The combination of SystemC models, the synthesizable PowerPC cores and design services can deliver designers a complete PowerPC solution spanning all facets of SoC design from system-level design to implementation.

Developed in close collaboration between IBM and the Synopsys Professional Services and DesignWare IP teams, the foundry-independent processor models support a broad range of design tools in the Synopsys Galaxy(TM) Design and Discovery(TM) Verification platforms. These design tools can help designers to address the full range of design issues including power reduction, signal integrity, design for manufacturing (DFM) and verification.

IBM's SystemC models of the PowerPC processor cores and IBM CoreConnect(TM) on-chip buses and peripherals will also be distributed by Synopsys for use with the System Studio tool. These transaction-level models can help product architects to efficiently explore high-level architectural trade-offs before committing to a specific implementation, and to facilitate pre-silicon hardware/software integration.

"There is tremendous demand for process portable versions of Power Architecture(TM)-based microprocessor cores for many applications within communications, consumer electronics and automotive segments," said Ron Martino, director of PowerPC Products at IBM. "This collaboration with Synopsys gives designers the ability to quickly implement customized Power Architecture based applications in world-leading semiconductor technologies. This announcement is an extension of our successful PowerPC and DesignWare Star IP relationship with Synopsys."

"Distribution of the synthesizable PowerPC cores through DesignWare Library and the SystemC models in the System Studio tool is a significant and natural extension of our multi-year collaboration with IBM on Power Architecture," said John Chilton, senior vice president and general manager of Synopsys' Solutions Group. "In addition to the pervasive DesignWare distribution channel and extensive customer support, Synopsys provides a reference design flow from system-level design through implementation that gives designers a proven, low-risk path to silicon with the flexibility to implement designs in their choice of process technologies."

Synopsys' distribution of the PowerPC models supports the goals of Power.org by providing designers around the world with access to the Power Architecture and with a means to implement it in their preferred process technology. Power.org is an open standards organization promoting the Power Architecture and its supporting technologies. Both IBM and Synopsys are founding members.

Synopsys and IBM will present additional details about the synthesizable PowerPC models at a "Power Lunch" event at the Design Automation Conference in Anaheim on June 14, 2005. Registration is available on-line through Synopsys at http://www.synopsys.com .

Availability

Design Views, including the simulation and timing models, a verification environment, and full documentation for the PowerPC 405 and 440, are currently available at no additional charge to DesignWare Library customers. For an additional fee, DesignWare Library users may license from IBM the Implementation Views of the core, including the fully synthesizable RTL; Synopsys will deliver the Implementation View(s) and will provide technical support. The Design Views can be downloaded from the Synopsys web site at http://www.synopsys.com/dwrequest .

SystemC models of the PowerPC 405 and 440 and selected CoreConnect peripherals are planned to be released with the System Studio tool in Q3 calendar 2005.

About DesignWare

Synopsys DesignWare(R) IP enables designers to quickly create and verify complex SoCs, ASICs and FPGAs. DesignWare gives designers a faster, more predictable and lower-risk path to chip success. The DesignWare Library Portfolio includes foundry libraries, verification IP, AMBA(TM) bus IP and peripherals, memories, building block IP and microcontrollers. All are available under one license with no additional costs, per use fees, or royalties. For more information on DesignWare IP, visit: http://www.designware.com or call 1-877-4BEST-IP

About IBM

IBM develops, manufactures and markets state-of-the-art semiconductor and interconnect technologies, products and services including industry-leading Power Architecture microprocessors. IBM semiconductors are a major contributor to the company's position as the world's largest information technology company. Its chip products and solutions power IBM eServer and TotalStorage systems as well as many of the world's best-known electronics brands. IBM semiconductor innovations include dual-core microprocessors, copper wiring, silicon-on-insulator and silicon germanium transistors, strained silicon, and eFUSE, a technology that enables computer chips to automatically respond to changing conditions. More information is available at: http://www.ibm.com/chips .

About Synopsys

Synopsys, Inc. is a world leader in EDA software for semiconductor design. The company delivers technology-leading semiconductor design and verification platforms and IC manufacturing software products to the global electronics market, enabling the development and production of complex systems-on-chips (SoCs). Synopsys also provides intellectual property and design services to simplify the design process and accelerate time-to-market for its customers. Synopsys is headquartered in Mountain View, California and has offices in more than 60 locations throughout North America, Europe, Japan and Asia. Visit Synopsys online at http://www.synopsys.com .

Forward Looking Statements

This press release contains forward-looking statements within the meaning of the safe harbor provisions of Section 21E of the Securities Exchange Act of 1934, including statements regarding the expected benefits and date of availability of SystemC models of the PowerPC 405 and 440 cores and selected CoreConnect peripherals. These statements are based on Synopsys' current expectations and beliefs. actual results could differ materially from these statements as a result of unforeseen difficulties in completing the collaboration with IBM development, uncertainties attendant to any new product release and the other factors contained in Synopsys' Quarterly Report on Form 10-Q for the fiscal quarter ended April 30, 2005.

NOTE: Synopsys and DesignWare are registered trademarks and Galaxy and Discovery are trademarks of Synopsys, Inc. Power Architecture and CoreConnect are trademarks of IBM. SystemC is a trademark of the Open SystemC Initiative and is used under license. All other trademarks or registered trademarks mentioned in this release are the intellectual property of their respective owners.

SOURCE Synopsys, Inc.

Sun, 26 Jun 2022 12:00:00 -0500 en text/html https://www.design-reuse.com/news/10591/synopsys-ibm-fully-synthesizable-powerpc-cores-systemc-models.html
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